2019
DOI: 10.1111/jace.16489
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Revealing the effects of aerosol deposition on the substrate‐film interface using NaCl coating

Abstract: Aerosol deposition is a feasible method of fabricating dense ceramic films at room temperature by the impact consolidation of submicron‐sized particles on ceramic, metal, glass, and polymer substrates at a rapid rate. Despite the potential usefulness of the aerosol deposition process, there are issues, such as deposition mechanisms and structure of the film‐substrate interface, that are not well understood. We have used complementary structural and microstructural analysis to capture the state of the substrate… Show more

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Cited by 10 publications
(20 citation statements)
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References 43 publications
(118 reference statements)
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“…[ 67 ] New studies by Khansur et al suppose that a change in surface chemistry and polarity as well as a physical interaction of the impacting particles with the substrate material promote a good interface and anchoring layer. [ 68 ] Naoe et al found evidence of the formation of covalent bonds in the interface between a copper substrate and alumina particles. [ 69 ] It is furthermore expected, that the formation of the anchoring layer can be viewed independently from the processes occurring during RTIC including film build‐up and densification through particle–particle interactions during impact.…”
Section: Powder Aerosol Depositionmentioning
confidence: 99%
“…[ 67 ] New studies by Khansur et al suppose that a change in surface chemistry and polarity as well as a physical interaction of the impacting particles with the substrate material promote a good interface and anchoring layer. [ 68 ] Naoe et al found evidence of the formation of covalent bonds in the interface between a copper substrate and alumina particles. [ 69 ] It is furthermore expected, that the formation of the anchoring layer can be viewed independently from the processes occurring during RTIC including film build‐up and densification through particle–particle interactions during impact.…”
Section: Powder Aerosol Depositionmentioning
confidence: 99%
“…PAD is based on an abrasion and deformation of the substrate surface, as it was observed by various groups, mostly described as a formation of an anchoring layer. [49][50][51] The same may happen to the annealed surface of the first film when depositing the second film. When also the second film is annealed by the laser, the resistance decreases further as shown in Figure 11c,d.…”
Section: Multilayer Pad Film With Multiple Laser-annealing Stepsmentioning
confidence: 99%
“…According to the polarization switching model by Hwang et al., [ 99 ] a certain threshold energy ( w ds ) is required to reorient domains, and it can be expressed in terms of the electric field and mechanical stress components: σijΔεij+EiΔPiwds where σ ij and E i are the applied stress and electric field and ∆ ε ij and ∆ P i change in strain and polarization during a ferroelectric or ferroelastic switch. In the present case, the biaxial residual stress in the substrate [ 65,68 ] is acting cooperatively with the electric field applied perpendicular to the film/substrate interface, thereby reducing the electrical energy required to induce a long‐range ferroelectric order and reorient domains. This additional mechanical energy, however, is not present in the sample with the sputtered electrode, resulting in a higher applied electric field required.…”
Section: Resultsmentioning
confidence: 99%
“…[ 65 ] Moreover, during the initial layer formation in the AD process, the deposition stresses need to be accommodated by the substrate, that is, plastic deformation and internal residual stress are also induced in the substrate. [ 68 ] This effect, for example, has been shown to result in plastic deformation of Si substrates during AD. [ 69 ]…”
Section: Introductionmentioning
confidence: 99%