Revealing Subsurface Damage Morphology and Patterns in areal Ultrashort Pulse Laser Machining of Glass
Samson Frank,
Maria Reichenbächer,
Michael Seiler
et al.
Abstract:Material removal rates as well as surface and subsurface quality are key aspects for the industrial application of ultrashort pulse (USP) laser machining. However, revealing so-called subsurface damage (SSD) is challenging. The presented study visualizes and quantifies subsurface damage patterns in areal USP laser ablation of fused silica (FS) and glass N-BK7 (BK). For the first time, using high-resolution optical coherence tomography (OCT) as non-destructive and three-dimensional (3D) evaluation method, SSD m… Show more
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