Return via connections for extending signal link path bandwidth of via transitions

Chang, Xin; Archambeault, Bruce; Cocchini, Matteo; Paulis, Francesco de; Sivarajan, Vysakh; Zhang, Yaojiang; Fan, Jun; Connor, Samuel; Orlandi, Antonio; Drewniak, James L.

doi:10.1109/emceurope.2008.4786874

Cited by 17 publications

(2 citation statements)

References 3 publications

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“…The solid arrows show the conduction current for the signal, the dashed arrows the return conduction current and the dotted arrows the return displacement current. The via model in Fig.1 takes into account both the capacitive effects of the via barrel with respect to the power planes and the power plane impedance through which the signal return current flows [1]. When two vias are connected to the two traces of a differential net, they behave as a transmission line with one of the two vias as reference conductor where the return current flows.…”

Section: Differential Via Modelingmentioning

confidence: 99%

An equivalent circuit model for the identification of the stub resonance due to differential vias on PCB

Ricchiuti¹,

Paulis

Orlandi

2009

2009 IEEE Workshop on Signal Propagation on Interconnects

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The modern telecommunication equipments consist of boards connected by thick backplanes where differential traces on different layers transmit high speed digital signals. These signals switch from different layers by means of plated through holes that, when not used, are stubs introducing dips on the insertion losses of the used traces. The paper presents an algorithm for modeling differential vias connected to differential traces, so to evaluate the resonance frequency due to the stubs connected to the vias.978-1-4244-4489-2/09/$25.00

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Section: Differential Via Modelingmentioning

confidence: 99%

An equivalent circuit model for the identification of the stub resonance due to differential vias on PCB

Ricchiuti¹,

Paulis

Orlandi

2009

2009 IEEE Workshop on Signal Propagation on Interconnects

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“…Due to its advantage and wide usage in current microelectronic systems, an accurate, fast, and efficient method of modeling scattering among multiple vias sharing one antipad is useful. A number of classes of methods have been developed to model the crosstalk or coupling mechanism, such as methods developed in [1]- [4]. Most of these models make simplifying assumptions such as assuming circularly shaped antipads, considering only the TEM mode and neglecting the axiallyanisotropic modes, etc.…”

Section: Introductionmentioning

confidence: 99%

Modeling of Vias Sharing the Same Antipad in Planar Waveguide With Boundary Integral Equation and Group T-Matrix Method

Tsang

Chang

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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We consider multiple scattering among different groups of vias with each group of vias sharing one antipad in planar waveguide. A transformation is used that converts the 2-D discretization and 2-D surface integration of the product of Green's functions and magnetic surface currents into 1-D discretization and 1-D integration of surface charges on the vias and on the ground plane. This is used to calculate the incident fields onto the vias. Based on the incident fields, the Foldy-Lax equations can be solved to calculate the circuit parameters for the problem. We show that the results are superior to the previously used finite difference method. In addition, the group T-matrix method is used to represent a group of vias to account for the scattering among different groups of vias. Results are illustrated for various cases of multiple vias up to 20 GHz. Results show the accuracy of the method even to very closely spaced vias when they are separated by merely 1 mil. Numerical results are in excellent agreement with ANSOFT HFSS.

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Analytical calculation of conduction and displacement current contributions in PCB return current paths

Müller

Rimolo-Donadío

Duan

et al. 2012

2012 Asia-Pacific Symposium on Electromagnetic Compatibility

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This paper studies the distribution of via return currents in printed circuit boards and packages. Generally, each return current splits into a conduction current through the ground vias of the structure and a displacement current between the reference planes. An analytical method for the calculation of both conduction and displacement current is described together with an equivalent circuit. The application of the calculation method to simple test structures illustrates the fundamental behavior of the return current. In certain frequency ranges, the magnitude of the displacement current in the return path can become considerably larger than the original signal current. The increase of the displacement current is of interest since it may cause e.g. signal integrity problems.

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Return via connections for extending signal link path bandwidth of via transitions

Cited by 17 publications

References 3 publications

An equivalent circuit model for the identification of the stub resonance due to differential vias on PCB

An equivalent circuit model for the identification of the stub resonance due to differential vias on PCB

Modeling of Vias Sharing the Same Antipad in Planar Waveguide With Boundary Integral Equation and Group T-Matrix Method

Analytical calculation of conduction and displacement current contributions in PCB return current paths

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