Retraction Note: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages

Surendar, A.; Siswanto, Waluyo Adi; Alijani, Maryam; Alhaifi, K.; Salmani, Mohammad

doi:10.1007/s00542-023-05445-6

Microsyst Technol

2023

DOI: 10.1007/s00542-023-05445-6

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Retraction Note: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages

A. Surendar

Waluyo Adi Siswanto

Maryam Alijani

et al.

Abstract: Publisher's Note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

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Retraction Note: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages

Abstract: Publisher's Note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

This publication either has no citations yet, or we are still processing them

See others like this or search for similar articles

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