Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach

Xu, Guangchen; Guo, Fu; Wang, Xitao; Xia, Zhidong; Liu, Yongping; Shi, Yaowu; Li, Xiaoyan

doi:10.1016/j.jallcom.2010.09.123

Cited by 36 publications

(7 citation statements)

References 28 publications

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“…Different types of studies have been done to find a way to increase the Sn-Bi solder alloy's reliability including adding alloying elements [19,20], microparticles [21,22], nanoparticles (NP) [23][24][25][26][27] and carbon nanotubes [28]. In the past, Ni [29], Sb [30], Cu and Zn [31] and Ag [32,33] have been added to the Sn-Bi solder joint.…”

Section: Introductionmentioning

confidence: 99%

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Bashir

Saad

Rizwan

et al. 2022

J Mater Sci: Mater Electron

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Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.

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Section: Introductionmentioning

confidence: 99%

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Bashir

Saad

Rizwan

et al. 2022

J Mater Sci: Mater Electron

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“…Researchers have found that composite solders that are prepared with the addition of an external reinforced phase or by an alloying method can improve the performance of the solder joint and reduce the risk of failures caused by EM. For example, it has been found that the addition of an appropriate quantity of metallic material such as Co, Ni, Sb and Zn, a non-metallic material such as ZnO and Al 2 O 3 , or a carbon nano-material such as carbon nanotubes into a conventional Sn-based solder, can suppress the EM phenomenon to an extent (Sun et al , 2016; Zhao et al , 2013; Hu et al , 2013; Xu et al , 2011; Wang and Li, 2016; Wang et al , 2017; Bashir et al , 2016; Yang et al , 2013). In the authors’ previous work a new type of lead-free composite solder that was alloyed with nickel-plated graphene (Ni-GNS), was developed (Chen et al , 2016a, 2016b).…”

Section: Introductionmentioning

confidence: 99%

The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing

Chen

Kuang

et al. 2019

SSMT

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Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints before and after an electro-migration (EM) experiment. Design/methodology/approach In this paper, SAC305 solder alloy doped with 0.1 Wt.% Ni-GNS was prepared via the powder metallurgy method. A U-shaped sample structure was also designed and prepared to conduct an EM experiment. The EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both solder joints under EM stressing were comparatively studied using SEM and nanoindentation. Findings The experimental results showed that for the SAC305 solder, the interfacial intermetallic compounds (IMC) formulated a protrusion with an average height of 0.42 µm at the anode after 360 h of EM stressing; however, despite this, the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, while the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/ Ni-GNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode side; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, while the hardness data showed a relatively homogeneous distribution in the SAC305/ Ni-GNS solder joint. Originality/value The experimental results showed that the Ni-GNS reinforcement could effectively mitigate the EM behavior in solder joints under high current stressing. Specifically, the Ni particles that plated the graphene sheets can work as a fixing agent to suppress the diffusion and migration of Sn and Cu atoms by forming Sn-Cu-Ni IMC. In addition, the nanoidentation results also indicated that the addition of the Ni-GNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high current densities.

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“…However, application of Sn-58Bi solder is limited by bulky Bi-rich precipitates which lead to crack propagation. 3 Some researchers have reported the effect of alloying elements, such as Ag, 4,5 Cu, 6 Co, 7 Sb, 8 RE, 9,10 Ni, 11,12 etc. Chuang et al 13 revealed that the microstructure of Sn-58Bi solder was refined by adding 0.5 wt.% Ce, and whiskers were not found in Sn-Bi-Ce alloy under high-temperature storage.…”

Section: Introductionmentioning

confidence: 99%

Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder

Yang

Dai

Zhang

et al. 2015

Journal of Elec Materi

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The effect of BaTiO 3 nanoparticles on the microstructure, wettability, and mechanical properties of Sn-58Bi solder has been investigated. The results show that the microstructure of the Sn-58Bi-x wt.%BaTiO 3 (x = 0.5, 1, 2, 3) composite solders is refined and homogeneous due to increasing heterogeneous nucleation sites of BaTiO 3 nanoparticles in the solder matrix. The best wettability with spreading coefficient of 0.86 was obtained for Sn-Bi-1 wt.%BaTiO 3 , increased by 10.24% compared with Sn-58Bi solder. High mechanical properties were achieved for Sn-58Bi solder with small addition (0.5 wt.% to 3 wt.%) of BaTiO 3 . The ultimate tensile strength (UTS) of Sn-58Bi is 44.7 MPa, and that of Sn-Bi-1%BaTiO 3 is 59.1 MPa. Fracture surface analysis indicated that the microscopic fracture of Sn-Bi-1%BaTiO 3 solder is composed of tearing marks and ductility is improved. Therefore, Sn-Bi1%BaTiO 3 composite solder is one of the candidates for packaging and interconnection applications.

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Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach

Cited by 36 publications

References 28 publications

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing

Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder

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