2020
DOI: 10.1021/acs.jpcc.9b10908
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Restricted Aggregate Formation on Tetraphenylethene-Substituted Polythiophenes

Abstract: Two new polythiophenes functionalized with different degrees of tetraphenylethene, TPE, side groups (with TPE moieties at each thiophene unit, homoPT, and one in which only each second thiophene unit carries a TPE side chain, coPT) were successfully synthesized and characterized together with a poly(3hexylthiophene) with similar average molecular weight and a tetraphenylethene-thiophene model compound. The study aimed to understand the role of the sterically bulky TPE pendant groups on the inhibition of intra-… Show more

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Cited by 15 publications
(13 citation statements)
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“…Considerable efforts have been devoted to overcome the existing barriers to a certain extent. 35,36 However, achieving high quantum efficiency, easy film-forming ability and high charge carrier mobility in organosilicon polymers still remains challenging.…”
Section: Introductionmentioning
confidence: 99%
“…Considerable efforts have been devoted to overcome the existing barriers to a certain extent. 35,36 However, achieving high quantum efficiency, easy film-forming ability and high charge carrier mobility in organosilicon polymers still remains challenging.…”
Section: Introductionmentioning
confidence: 99%
“…[ 27,28 ] Therefore, as the external pressure increases, the maximal fluorescence emission wavelength (λ max ) blueshifts when the TPE derivatives form H‐type aggregates, whereas it redshifts when the TPE derivatives form J‐type aggregates. [ 22,29–33 ]…”
Section: Introductionmentioning
confidence: 99%
“…[27,28] Therefore, as the external pressure increases, the maximal fluorescence emission wavelength (λ max ) blueshifts when the TPE derivatives form H-type aggregates, whereas it redshifts when the TPE derivatives form J-type aggregates. [22,[29][30][31][32][33] The available methods for achieving high heat dissipation by encapsulating electronic components in epoxy molding compounds (EMCs) are improving steadily, which enables packaging semiconductors to prevent damage and efficiently remove internally generated heat. [34,35] EMC components are molded via transfer or injection molding processes, wherein the epoxy (EP) is exposed to high temperatures and pressures.…”
mentioning
confidence: 99%
“…[11][12][13][14][15][16] However, when aggregation is not well-controlled, significant aggregation-caused quenching (ACQ) appears due to the formation of less emissive species. 17 Challenging issues are therefore to control the domain separation at a supramolecular level and the randomness in orientation of the fluorophores. 18 This approach takes its inspiration from crucial life processes where clusters or aggregates of individual elements are held together by weak intermolecular forces and are considered as single units.…”
Section: Introductionmentioning
confidence: 99%
“…However, when aggregation is not well-controlled, significant aggregation-caused quenching (ACQ) appears due to the formation of less emissive species . Challenging issues are therefore to control the domain separation at a supramolecular level and the randomness in orientation of the fluorophores .…”
Section: Introductionmentioning
confidence: 99%