Response surface methodology for matrix PBGA warpage prediction

Egan, E.; Kelly, G.; O'Donovan, T.; Murtagh, D.; Herard, L.

doi:10.1109/itherm.2000.866850

Cited by 9 publications

(2 citation statements)

References 12 publications

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“…Therefore, process design of transfer moulding for electronic packages basically is a multiobjective optimisation problem. At present, there are only few reports in the literature regarding the optimisation of transfer moulding for electronic packages [1,2]. In fact, most of the works are related to single objective optimisation.…”

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Process optimisation of transfer moulding for electronic packages using artificial neural networks and multiobjective optimisation techniques

Tong

Kwong

2004

Int J Adv Manuf Technol

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Transfer moulding is the most common process for the encapsulation of electronic packages in semiconductor manufacturing. Quality of the moulding is affected by a large number of mould design parameters and process parameters. Currently, the parameters setting is performed by experienced engineers in a trial and error manner and often the optimal setting can not be obtained. In the face of global competition, the current practice is inadequate. In this research, a process optimisation system for transfer moulding of electronic packages is described which involves design of experiments (DOE) techniques, artificial neural networks (ANNs), multiple regression analysis and the minimax method. The system is aimed to determine the optimal mould design parameters and process parameter settings of transfer moulding of electronic packages for multiobjective problem. Implementation of the optimisation system has demonstrated that the time for the determination of optimal mould design parameters and process parameters setting can be greatly reduced and the parameters setting recommended by the system can contribute to the good quality of moulded packages without relying on experienced engineers.

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“…Cheung [1] used RSM to model and optimise the transfer moulding of electronic packages such that the warpage of moulded packages could be minimised. Egan et al [2] employed RSM to construct an empirical model for Matrix PBGA warpage prediction. In their work, a response surface model was created to relate the package dimensions and degree of warpage.…”

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Process optimisation of transfer moulding for electronic packages using artificial neural networks and multiobjective optimisation techniques

Tong

Kwong

2004

Int J Adv Manuf Technol

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Intelligent process design system for the transfer moulding of electronic packages

Tong

Kwong

2004

International Journal of Production Research

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Advanced warpage prediction methodology for matrix stacked die BGA during assembly processes

Zhang

Tee

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)

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A comprehensive warpage analysis is performed on the malrix stacked die BGA (SDBGA) by means of finite element modeling, and experimental warpage measurements. By coniparing the block warpage results from conventional linear smdl deformation simulation and the experimental measurement results, it is found that the linear method is not abla to capture the warpage behavior of the SDBGA matrix, because the change of the centroidal moment of inertia of cross-section after deformation cannot be considered due to small deformation assumption. The nonlinear large deformation analysis must be taken instead. Base on the non linear analysis, an advanced warpage prediction methodology for matrix SDBGA is established. This methodology is then used to characterize the warpage behaviour of matrix SDBGA, and to study the different effects on the warpage. Warpage of matrix SDBGA during the whole assembly processes are also predicted. For the SDBGA matrix investigated, the crossbow dominant warpage and buckling phenomena are observed for the matrix after botlom die bonding and after interposer bonding, which are new findings in warpage study for electronic packages. It is also found that not only the total die length, but also the dice distribution will affect the warpage pattern of the matrix. For the matrix after top die bonding and after molding, normal warpage patterns are observed, i.e. both crossbow and coilset warpage are comparable. "Bending interaction" and the "waqage competition" mechanisms are proposed to explain the warpage characteristic for matrix SDBGA.

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Response surface methodology for matrix PBGA warpage prediction

Cited by 9 publications

References 12 publications

Process optimisation of transfer moulding for electronic packages using artificial neural networks and multiobjective optimisation techniques

Process optimisation of transfer moulding for electronic packages using artificial neural networks and multiobjective optimisation techniques

Intelligent process design system for the transfer moulding of electronic packages

Advanced warpage prediction methodology for matrix stacked die BGA during assembly processes

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