Processes for fabricating full wafers of UHF quartz MEMS oscillators bonded to Si have been developed at HRL over the past several years. These devices have shown state-of-the-art noise and stability along with extremely small vacuum packaged die size of less than 3 mm 2 . An interesting by-product of the high frequency, small size, and wafer-scale fabrication of these devices is that several novel dynamics-based enhancements can be considered. These include the use of nonlinear dynamics for reducing oscillator phase noise at CMOS capable voltages and co-integration with more complex structures for sensing vibration and serving as a local timing reference for reducing thermally-induced sensor drifts. Several of these novel concepts made possible by wafer-scale MEMS-based processing will be reviewed.