Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCBs

Kushta, Taras; Narita, Kôichi; Kaneko, Tomoya; Saeki, T.; Tohya, Hirokazu

doi:10.1109/lmwc.2003.811678

Cited by 59 publications

(19 citation statements)

References 5 publications

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“…Geometric dimensions of three basic test cases. The QWOSR via can excite the displacement current and propagate in the radius direction between the two ground planes in the absence of ground vias [14,15]. The four additional ground vias are well known to help provide a current return path of displacement current excited by QWOSR via because the impedance of the ground via approaches 0 Ω (shorting path) [16,17].…”

Section: Parallel-plane Resonant Effect On Inserted Lossmentioning

confidence: 99%

Low Noise Generation of Rfi Noise Suppression Filter for Power Trace by Using Quarter-Wavelength Open-Stub Resonator in Multilayered High-Speed Digital PCB

Shiue¹,

You²,

Hung³

et al. 2017

PIER B

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Abstract-This work proposes a radio-frequency interference (RFI) noise suppression filter with low noise generation for a power trace. This is based on a quarter-wavelength open-stub resonator (QWOSR) in a multilayered high-speed digital PCB (printed circuit board). RFI noise with frequencies at 2.4 GHz and 5 GHz is considered. The proposed filter structure is a four-layer PCB. The low noise generation includes the following schemes. The trace of the QWOSR is a stripline on the third layer. Four ground vias are added adjacent to the QWOSR via, which is short. Electromagnetic (EM) radiation noise plan cavity resonance, ground bounce noise (GBN), and peak noise on insertion loss (|S 21 |) are all reduced. The electric field distributions are elucidated to understand the effect of cavity resonance on the insertion loss (|S 21 |) values of the proposed filter structure. The proposed filter structure significantly reduces the time-domain ground bounce and power noise whose frequency is equal or close to the center frequency of filter. Finally, favorable comparisons between simulated and measured results confirm the excellent low noise generation performance of the proposed filter structure.

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Section: Parallel-plane Resonant Effect On Inserted Lossmentioning

confidence: 99%

Low Noise Generation of Rfi Noise Suppression Filter for Power Trace by Using Quarter-Wavelength Open-Stub Resonator in Multilayered High-Speed Digital PCB

Shiue¹,

You²,

Hung³

et al. 2017

PIER B

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“…The scattering parameters in the s-blocks are extracted from the full-wave simulations, the transmission line (TL) is assumed to be ideal. The length of the TL was chosen to fulfill the matching condition 1 1…”

Section: Matching Using Single Shorted Via Stubsmentioning

confidence: 99%

“…It is well known though that at frequencies when the dimensions of a PCB get into the range of the wavelength, vias may show severe parasitic effects that can have detrimental impacts on e.g. the bandwidth of digital links [1]. A major contributor to these parasitic effects is the so-called via stub -any part of a via that is not an element of the direct signal path -since via stubs show a resonant behavior similar to open transmission lines due to wave effects.…”

Section: Introductionmentioning

confidence: 99%

Double stub matching in multilayered printed circuit board using vias

Hardock

Rimolo-Donadío

Brüns

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

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In this paper the authors present the application of functional vias to narrowband load matching in the frequency range from 2 up to 20 GHz. The utilization of single and double stub matching is demonstrated. Corresponding network parts basically contain one or two via stubs and transmission line elements, e. g. striplines and microstrips. It is also shown that in most of the given frequency range vias and via stubs can be characterized as transmission lines. Especially the influence of the via configuration on the characteristic impedance and the propagation constant are analyzed in order to investigate their feasibility for matching purposes. Influences are the via length, the number of adjacent ground vias and their distance to the signal via. The analysis is done for open and shorted vias and is based on measurements, fullwave simulations and physics-based via models. Examples include matching networks with inductive loads up to several nH. IntroductionVias are essential components of multilayered printed circuit boards (PCBs) for both digital and analog applications. They provide intralevel electrical interconnections for signal and power distribution networks. It is well known though that at frequencies when the dimensions of a PCB get into the range of the wavelength, vias may show severe parasitic effects that can have detrimental impacts on e.g. the bandwidth of digital links [1]. A major contributor to these parasitic effects is the so-called via stub -any part of a via that is not an element of the direct signal path -since via stubs show a resonant behavior similar to open transmission lines due to wave effects. As a consequence open via stubs may act as electric shorts at their opposite ends resulting in near-zero signal transmission. However, in another perspective open via stubs may be considered as vertically integrated transmission lines that can be used for typical RF applications such as stub matching [2].Based on measurements, full-wave simulations and physics-based via models [3], a general characterization of vias and the via stub is made in the first part of this work in order to establish the equivalence to transmission lines below 20 GHz as reported in other publications [4]. Arguing from this equivalence the application of single and double via stubs in a matching network will be shown. Open and shorted stub matching and the impact of the via geometry will be demonstrated to match inductive loads up to 3 nH. Figure 1 illustrates the basic geometry of such a matching configuration.

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“…In these cases, stub effect (Laermans et al, 2001;Kushta et al, 2003) can be removed providing an improvement of signal transmission channel parameters, and the signal via conductor length can be shortened providing a reduction of coupling and radiating areas. However, in spite of such advancements problems emphasized above remain at microwaves and millimeter waves.…”

Section: Shield Via As Vertical Transmission Lines For Multilayer Submentioning

confidence: 99%

Vertical Transmission Lines in Multilayer Substrates and Highly-Integrated Filtering Components Based on These Transmission Lines

Kushta¹

2010

Passive Microwave Components and Antennas

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Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCBs

Cited by 59 publications

References 5 publications

Low Noise Generation of Rfi Noise Suppression Filter for Power Trace by Using Quarter-Wavelength Open-Stub Resonator in Multilayered High-Speed Digital PCB

Low Noise Generation of Rfi Noise Suppression Filter for Power Trace by Using Quarter-Wavelength Open-Stub Resonator in Multilayered High-Speed Digital PCB

Double stub matching in multilayered printed circuit board using vias

Vertical Transmission Lines in Multilayer Substrates and Highly-Integrated Filtering Components Based on These Transmission Lines

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