“…Assembling LSMO and LCMO together is expected to obtain large MR and low r over a wider temperature range near room temperature. Pb 0.6 Sr 0.4 TiO 3 (PST) was chosen as dielectric layer for its excellent dielectric properties, whose lattice structure is simple and has only one phase transition, that is the ferroelectric-paraelectric phase transition, and the T c is far above 400 K. [27][28][29] Compared with pulsed laser deposition and sputtering, CSD has the advantages of excellent chemical homogeneity, easy control of stoichiometry, and suitable for large area. [30][31][32] Si wafer was chosen as substrate because the Si wafer is one of the main micro-electronic materials, which is essential for future commercial applications.…”