2020
DOI: 10.1039/d0ra05209d
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Resistance state evolution under constant electric stress on a MoS2 non-volatile resistive switching device

Abstract: Constant voltage and current stress were applied on MoS2 resistive switching devices, showing unique behaviors explained by a modified conductive-bridge-like model.

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Cited by 9 publications
(11 citation statements)
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“…Based on our previous studies on 2D TMD-based RRAM devices, a "conductive-point" model was proposed to illustrate the resistive switching mechanism (Wu et al, 2020;Wu et al, 2021). When applying external voltage bias, metal ions/atoms from TE can be dissociated triggered by the electrical field and adsorbed into the chalcogen defects in the ReSe 2 layer.…”
Section: Resultsmentioning
confidence: 99%
“…Based on our previous studies on 2D TMD-based RRAM devices, a "conductive-point" model was proposed to illustrate the resistive switching mechanism (Wu et al, 2020;Wu et al, 2021). When applying external voltage bias, metal ions/atoms from TE can be dissociated triggered by the electrical field and adsorbed into the chalcogen defects in the ReSe 2 layer.…”
Section: Resultsmentioning
confidence: 99%
“…More details about the processes followed are given in the experimental section. Then, a ≈17 nm thick Au film is deposited everywhere on the samples via electron beam evaporation, using a deposition speed of 0.52 Å s −1 and a power of 11%; note that these parameters are similar to those often used in other studies, [31][32][33] and are considered to introduce low damage in the materials. [34] Figure 1f shows the optical microscope image of the h-BN flake locally protected with negative photoresist before the Au evaporation, and Figure 1g shows the optical microscope image of the h-BN flake protected with transferred Au electrode (on the top side of the flake) and with Ag ink (in the bottom side of the flake).…”
Section: Atomic Structure Of Multilayer H-bnmentioning
confidence: 99%
“…23 The diamond substrate was chosen due to its high thermal conductivity to sink the generated heat and maintain reliable device performance during the electrical measurements. 17,19,20 Figure 1c shows an optical microscopy (OM) image of the crossbar structure with an atomristor area of 1.0 × 1.0 μm 2 . The bottom Ag electrode was patterned and deposited onto the diamond substrate through electron beam (e-beam) lithography and evaporation systems.…”
Section: Introductionmentioning
confidence: 99%