2014
DOI: 10.1016/j.apsusc.2014.04.147
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Resist materials for proton beam writing: A review

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Cited by 37 publications
(21 citation statements)
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“…Taking account of the penetration depth of 150 keV protons presented in the TRIM depth profiles (Fig. S1), microstructures with a higher aspect ratio can be reliably generated even at a fluence of 3 · 10 15 ions cm À2 within the film thickness of 1.5 lm [32].…”
Section: Fabrication Of Gcms By Ion Beam Contact Lithography and Carbmentioning
confidence: 99%
“…Taking account of the penetration depth of 150 keV protons presented in the TRIM depth profiles (Fig. S1), microstructures with a higher aspect ratio can be reliably generated even at a fluence of 3 · 10 15 ions cm À2 within the film thickness of 1.5 lm [32].…”
Section: Fabrication Of Gcms By Ion Beam Contact Lithography and Carbmentioning
confidence: 99%
“…Second, focused proton beam writing (PBW) has been used for microfabrication of inorganic materials [31,32] and hard polymers [33][34][35][36] for decades. PBW is a novel technique that draws by a focused proton beam with an energy of the order of MeV on target materials [37].…”
Section: Introductionmentioning
confidence: 99%
“…The method of micromachining of materials using deep ion beam lithography was first presented in 1997 [1] and well established in the following years [2]. Since then various properties of different types of materials have been shown to be sensitive to MeV energy proton beam irradiation [3]. Among these materials, poly(tetrafluoroethylene) is one whose surface structure can be modified with MeV proton beams.…”
Section: Introductionmentioning
confidence: 99%