2019
DOI: 10.1021/acs.jpcc.9b00408
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Resilience of Cuprous Oxide under Oxidizing Thermal Treatments via Magnesium Doping

Abstract: This study reports the influence of the magnesium incorporation into cuprous oxide (Cu2O) on its transformation in cupric oxide (CuO). Thermal treatments under oxidizing conditions are performed on undoped and magnesium-doped cuprous oxide thin films, Cu2O and Cu2O:Mg respectively, deposited by aerosol-assisted metal organic chemical vapour deposition. The oxidation kinetics of these films shows a slower rate in the Cu2O:Mg system, since the complete oxidation into CuO occurs at a higher temperature when compa… Show more

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Cited by 13 publications
(14 citation statements)
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“…For intrinsic Cu 2 O samples we obtained a reduction of the resistivity only during the 250 °C annealing step, leading to a final room temperature value for the resistivity of 80 ± 1 Ω cm, presented in Table 1 . The annealing treatments at 350 °C and 450 °C increase the resistivity, leading to a final resistance higher than that of the original film, especially in the 450 °C case, where the resistivity reaches 1650 ± 10 Ω cm, allegedly attributed to the formation of CuO, as previously reported 17 . For the Cu 2 O:Mg thin films, we observed a different trend when compared to the intrinsic Cu 2 O samples, since all the thermal treatments lead to a reduction of the final resistivity at room temperature compared to the initial value, with the lowest resistivity value of 13.3 ± 0.1 Ω cm observed for the sample annealed at 450 °C, presented on Table 1 .…”
Section: Resultssupporting
confidence: 78%
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“…For intrinsic Cu 2 O samples we obtained a reduction of the resistivity only during the 250 °C annealing step, leading to a final room temperature value for the resistivity of 80 ± 1 Ω cm, presented in Table 1 . The annealing treatments at 350 °C and 450 °C increase the resistivity, leading to a final resistance higher than that of the original film, especially in the 450 °C case, where the resistivity reaches 1650 ± 10 Ω cm, allegedly attributed to the formation of CuO, as previously reported 17 . For the Cu 2 O:Mg thin films, we observed a different trend when compared to the intrinsic Cu 2 O samples, since all the thermal treatments lead to a reduction of the final resistivity at room temperature compared to the initial value, with the lowest resistivity value of 13.3 ± 0.1 Ω cm observed for the sample annealed at 450 °C, presented on Table 1 .…”
Section: Resultssupporting
confidence: 78%
“…It is expected that this complex prevents the formation of split vacancies for a single cation vacancy, since the divalent cation would assume a position similar to a split copper vacancy ( V split ) in the crystallographic structure 42 . As a consequence, Cu 2 O:Mg materials present an increased response in photoconductivity 14 and exhibit improved chemical stability at high temperatures 14 , 17 , as already reported in the literature. Additionally, this complex would further increase the charge carrier density after annealing treatments in oxidizing conditions, by a simple copper vacancy doping mechanism assisted by the magnesium incorporation 13 .…”
Section: Discussionsupporting
confidence: 72%
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“…Their intensity increases with Cu content, suggesting a greater number of defects for = 65% when compared to = 40%. For = 67%, spectra (3) in Figure 1 b, the E u mode of the CuCrO 2 at 96 cm −1 is detected, while additional Raman modes, at 108 cm −1 , 149 cm −1 , 216 cm −1 , 495 cm −1 , and 649 cm −1 are attributed to the presence of the Cu 2 O phase [ 48 ]. This statement is confirmed by the comparison with the spectrum of pure Cu 2 O deposited in the same deposition conditions ( Figure 1 b, spectra (4)).…”
Section: Resultsmentioning
confidence: 99%