Residual stresses and microstructure in tungsten thin films analyzed by x-ray diffraction-evolution under ion irradiation

Durand, Nicolas; Badawi, K.F.; Goudeau, P.

doi:10.1063/1.363547

Cited by 38 publications

(9 citation statements)

References 30 publications

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“…Such high compressive stresses promote a columnar growth, the iron nanoparticles keeping an elongated shape after the co-deposition process. As stated above, the vacancy mobility and atom diffusion length are both increased with a 100 keV Ar + irradiation, which can also induce a total stress relaxation (Durand et al;. This may explained why the elongated precipitates transform into spheres when they are irradiated with a 100 keV argon beam.…”

Section: Discussionmentioning

confidence: 81%

“…Within an isotropic medium, ellipsoid is not the most stable shape as far as the interfacial energy is concerned. However, high compressive stresses (sometimes higher than a few GPa) can exist in thin films deposited by co-sputtering (Durand et al;. Such high compressive stresses promote a columnar growth, the iron nanoparticles keeping an elongated shape after the co-deposition process.…”

Section: Discussionmentioning

confidence: 99%

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Morphology of encapsulated iron nanoparticles obtained by co-sputtering and implantation: a GISAXS study

Babonneau¹,

Naudon²,

Cabioc’h³

et al. 2000

J Appl Crystallogr

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A grazing incidence small‐angle X‐ray scattering (GISAXS) study is presented on the morphology of iron nanoparticles buried in carbon matrices, obtained either by ion‐beam sputtering co‐deposition or by ion‐implantation. It is shown that, depending on the experimental synthesis conditions, the shape of the iron nanoparticles is either spherical or elongated perpendicularly to the substrate. The possible growth mechanisms are examined in terms of volume and surface diffusion, defect density, interfacial energy and residual stress.

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Section: Discussionmentioning

confidence: 81%

Section: Discussionmentioning

confidence: 99%

Morphology of encapsulated iron nanoparticles obtained by co-sputtering and implantation: a GISAXS study

Babonneau¹,

Naudon²,

Cabioc’h³

et al. 2000

J Appl Crystallogr

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“…Most determined stress-free lattice parameter values are larger than the bulk reference parameter ͑0.3165 nm͒, indicating lattice expansion due to interstitial defects. 54 This parameter reaches the highest values ͑ϳ0.3185 nm͒ for 0.6 nm copper thickness ͑threshold for obtaining a single ͗110͘ texture component͒ and without copper interlayer. For 0.2 nm copper thickness, the stress-free parameter reaches its lowest value ͑ϳ0.3175 nm͒.…”

Section: Stress Analysismentioning

confidence: 92%

Copper coverage effect on tungsten crystallites texture development in W/Cu nanocomposite thin films

Girault¹,

Eyidi²,

Chauveau³

et al. 2011

Journal of Applied Physics

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Morphological and crystallographic structures of multilayered W/Cu nanocomposite thin films elaborated by physical vapor deposition were studied by varying copper and tungsten thicknesses. Sample examinations were performed by x-ray diffraction ͑XRD͒, grazing incidence small-angle x-ray scattering and transmission electron microscopy ͑TEM͒. Samples were found to be composed of copper nanoparticles, homogeneously dispersed in planes parallel to the film-substrate interface and periodically separated by tungsten layers along the growth direction. Our observations revealed an original texture development of the tungsten matrix from a mixture of unexpected ␣-W͗111͘ and ␣-W͗110͘ components to unique ␣-W͗110͘ component as the copper coverage passes a thickness threshold of 0.6 nm. Local TEM texture stereology investigations revealed simultaneous columnar growth of both preferential orientations posterior to polycrystalline development while XRD reveals strong compressive residual stresses in both texture components. Physical origins of the preferential crystallographic orientation evolution are discussed. Copper mono layers adsorption on W surfaces promotes surface energy anisotropy and diminution which is effective over the threshold. Below, the presence of a W͑Cu͒ solid solution which does not affect substantially the texture is revealed by the stress-free lattice parameter value extracted from XRD.

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“…The existence of huge compressive stresses in W films is mainly due to the deposition process (ion beam sputtering). Indeed, the deposited atom energy is relatively high (between 100 and 1000 eV) which leads to the well-known "atomic peening" effect [32]. A large number of defects are produced in the crystallographic lattice (self-interstitials, for instance) leading to strong distortions which can be revealed by an increase of the stress-free lattice parameter with respect to the reference value.…”

Section: Resultsmentioning

confidence: 99%

Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

Jia

Wang

Tamura

et al. 2018

QuBS

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Compressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms is necessary to preserve thin film integrity and optimize its functional properties. Thin shell theory has been used for decades to predict buckling but the results have not yet been correlated with experimental data since the techniques used to measure stress in metallic films were not able to do so at the required micron scale until recently. Micro scanning X-ray diffraction now enables the direct mapping of the local stress of metallic films. In this paper, finite element method based on thin shell theory and synchrotron X-ray micro diffraction have been used to determine stress maps of thin film buckling patterns. Calculations of the stress distribution in the metallic films have been performed taking into account the buckling geometry determined from optical measurements. Stress distributions over gold blisters and tungsten wrinkles obtained with the two techniques are in fair agreement and allow for the accurate determination of the stress relaxation profile from the bottom to the top of the buckling, validating the thin shell theory model.

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Residual stresses and microstructure in tungsten thin films analyzed by x-ray diffraction-evolution under ion irradiation

Abstract: Highresolution xraydiffraction analysis of epitaxially grown yttrium iron garnet films on gadolinium gallium garnet

Cited by 38 publications

References 30 publications

Morphology of encapsulated iron nanoparticles obtained by co-sputtering and implantation: a GISAXS study

Morphology of encapsulated iron nanoparticles obtained by co-sputtering and implantation: a GISAXS study

Copper coverage effect on tungsten crystallites texture development in W/Cu nanocomposite thin films

Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

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