Residual Stress Measurements in Electrolytic Copper‐Nickel Compositionally Modulated Multilayers

Abstract

Residual stresses in electrolyte copper-nickel compositionally modulated multilayers (CMM) deposited from sulfate plating solutions on low carbon steel substrates have been determined using a low incident beam angle x-ray diffraction technique. The sublayer thickness was varied from 0.1 to 1.5 txm, while the total thickness of the compositionally modulated multilayer was kept at 3 ~m. For reference, residual stress measurements were performed on electrolytic nickel deposited from Watts' nickel plating solutions. The evolution of the residual stresses in the compositionally modulated multilayers was measured as a function of the copper and nickel sublayer thicknesses. A general formula to calculate the x-ray information depth in CMMs was derived and used to obtain the residual stress depth profile in electrolytic coppernickel CMMs.

In situstress measurements during electrodeposition of Ag-Sb and Pt-Co alloy multilayers

“…The alteration of electrolysis conditions (concentration of the electrolyte components, pH, current density, temperature, agitation of the electrolyte) leads to change in the element and phase content of the layers deposited, resulting in changes of the respective properties of the deposit. For example, the change in the internal stresses of multilayer systems during electrolytic deposition has been measured by a number of authors [1][2][3].…”

High temperature oxidation protection using nanocrystalline coatings

“…The thickness of each sub-layer is in the range of a few nanometers to sub-micrometer level. The spacing between two layers is so small that the defect size and dislocation movement can be effectively suppressed by the interfaces, so that the properties of these multilayered coatings are different from those of the single-layer coatings (Celis et al , 1995;Levin et al , 1995). These properties may include fracture strength and toughness, fatigue and impact strengths.…”

Electrodeposition Science and Technology in the Last Quarter of the Twentieth Century

“…A good review of different methods for measuring stress in electrodeposits has been published in the early 1970s. 126 Several more recent papers discuss methods for in situ measurement of internal stress during electrodeposition including X-ray diffraction, 127,128 bending of thin film substrates, 129,130 strain gauge, 131 and the use of the electrochemical quartz crystal microbalance. 132 Copper is probably the most widely studied metal in electrodeposition, because of its industrial importance and because its noble equilibrium potential makes it well suited for fundamental studies without interference of hydrogen formation.…”