Residual Stress Determination by Hole Drilling Combined with Optical Methods

Nelson, D. V.

doi:10.1007/s11340-009-9329-3

Cited by 51 publications

(24 citation statements)

References 93 publications

(100 reference statements)

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“…However, it requires crystalline samples. Common destructive methods are curvature measurement [3], nanoindentation [4], hole drilling [5], etc. In addition, most of them determine the mean stress in large volumes or areas.…”

Section: Introductionmentioning

confidence: 99%

Statistical analysis of SEM image noise

Мансилла¹,

Ocelík²,

Hosson³

2013

Surface Effects and Contact Mechanics XI

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The stress-relaxation technique is one of the most popular approaches to measure macroscopic residual stresses in different kinds of materials. Recently, by using a dual beam microscope (Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) in one chamber), a new option of detection of internal stresses on a microscopic scale appeared. FIB is used to release local strain induced by internal stresses and Digital Image Correlation (DIC) of SEM images collected before and after stress release is applied to quantify strain release at the surface.However, the combination of DIC and SEM brings some new important aspects in the analysis of noise generated by the special way of building an SEM image. Because the magnitude of the strain is quite often very close to the noise level, it is very important to test each SEM column which is used in these measurements. It is necessary to study conditions for minimization and randomization of the noise generated during SEM image collection by instabilities inside electron column and sample chamber as well. In the present work, the methods for such testing will be given for a Philips XL30 ESEM.

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Section: Introductionmentioning

confidence: 99%

Statistical analysis of SEM image noise

Мансилла¹,

Ocelík²,

Hosson³

2013

Surface Effects and Contact Mechanics XI

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“…In particular, optical methods have increasingly been applied [57], notably because of their full-field measurements and their adaptability to a wide range of machining geometries and size scales. The optical techniques commonly used for residual stress measurement are Moiré Interferometry, Electronic Speckle Pattern Interferometry, and Digital Image Correlation.…”

Section: Materials Cutting and Deformation Measurement Technologymentioning

confidence: 99%

Relaxation Methods for Measuring Residual Stresses: Techniques and Opportunities

Schajer

2010

Exp Mech

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Relaxation methods, also called "destructive" methods, are commonly used to evaluate residual stresses in a wide range of engineering components. While seemingly less attractive than non-destructive methods because of the specimen damage they cause, the relaxation methods are very frequently the preferred choice because of their versatility and reliability. Many different methods and variations of methods have been developed to suit various specimen geometries and measurement objectives. Previously, only specimens with simple geometries could be handled, but now the availability of sophisticated computational tools and of high-precision machining and measurement processes has greatly expanded the scope of the relaxation methods for residual stress evaluation. This paper reviews several prominent relaxation methods, describes recent advances, and indicates some promising directions for future developments.

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“…As a result, many researchers have utilized fullfield methods such as brittle coatings [91], photoelastic coatings [92], holographic interferometry [93], electronic speckle pattern interferometry [13], shearography [94], interferometric strain gages [95] and digital image correlation [96]. In 2010 Schajer [97] wrote a review article on advances in hole-drilling while independently Nelson [98] wrote a review on the determination of residual stresses using optical methods. Both of these, quite recent articles list moiré interferometry as a viable technique that provides good spatial and measurement resolution, can determine the displacements at the hole edge, but can be cumbersome because of grating transfer.…”

Section: Hole-drillingmentioning

confidence: 99%

Recent Applications of Moiré Interferometry

Ifju

Han

2010

Exp Mech

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Moiré interferometry has been a valuable experimental technique for the understanding of the mechanical behavior of materials and structures. Over the last decade less emphasis has been placed on the development of the technique and more towards applications. This paper is a review article on recent applications using moiré interferometry in the fields of microelectronics devices, material characterization, micromechanics, residual stress, composite materials, fracture mechanics, and biomechanics. The general principles of moiré interferometry and advancement of techniques will not be discussed in this text, but references will be provided.

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Residual Stress Determination by Hole Drilling Combined with Optical Methods

Cited by 51 publications

References 93 publications

Statistical analysis of SEM image noise

Statistical analysis of SEM image noise

Relaxation Methods for Measuring Residual Stresses: Techniques and Opportunities

Recent Applications of Moiré Interferometry

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