1995
DOI: 10.1016/0032-3861(95)97876-h
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Residual stress build-up in thermoset films cured above their ultimate glass transition temperature

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Cited by 127 publications
(94 citation statements)
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“…Polymerisation shrinkage and cool-down from the process temperature are major sources of residual stress. [11,12] Combined with low stiffness, high coefficient of thermal expansion (CTE) [13] and surface tension driven viscous flow [14] these stresses lead to distortion and eventual decay of the nano-pattern.…”
Section: Introductionmentioning
confidence: 99%
“…Polymerisation shrinkage and cool-down from the process temperature are major sources of residual stress. [11,12] Combined with low stiffness, high coefficient of thermal expansion (CTE) [13] and surface tension driven viscous flow [14] these stresses lead to distortion and eventual decay of the nano-pattern.…”
Section: Introductionmentioning
confidence: 99%
“…Such measurements are obtained from one dimensional or possibly two dimensional strains in the material by means of a contacting or non-contacting transducer. Examples of instruments are rheometer [2,3], pycnometer [3][4][5], fibre bragg grating [6], thermo mechanical analyzer [7][8][9], dynamic mechanical analyzer [10], ultrasonic waves [11]etc.…”
Section: Introductionmentioning
confidence: 99%
“…11,[23][24][25] However, no correlations with chemical conversion were made. In view of the large differences in the rates of polymerization, such a correlation is essential.…”
Section: Dgebamentioning
confidence: 84%