Residual stress and microstructures of aromatic polyimide with different imidization processes

Nishino, Takashi; Kotera, Masaru; Inayoshi, Naruhiko; Miki, Norihiko; Nakamae, Katsuhiko

doi:10.1016/s0032-3861(00)00002-1

Cited by 55 publications

(26 citation statements)

References 13 publications

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“…The details about the transformation from initial polyamic acid (PAA) liquid precursor with open-ring state to final solid polyimide film with close imide ring can be found elsewhere. 11) In comparison to the Nishino's work for two-step and stepwise curing profile, this study adopts the simple one-step curing profile where the average ramp up rate is 2.0 C/min and the average ramp down rate is 4.0 C/min. The finally curing thickness is 6 mm.…”

Section: Methodsmentioning

confidence: 99%

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ATR-FTIR and Nanoindentation Measurements of PMDA-ODA Polyimide Film under Different Curing Temperature

et al. 2007

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ATR-FTIR apparatus is used to measure the curing rate of PMDA-ODA polyimide film in order to avoid sinusoidal interference fringe. From the corrected height method, the curing rate is found to have positive correlative trend with the curing temperature. It was shown that the curing rate under 300 C is 92.1% than that under 400 C for one hour. The curing degree related to the mechanical properties was further demonstrated by nanoindentation. The results show that the higher the curing rate the higher the nano-hardness and nano-modulus due to the thermal imidization of polyimide characteristic. The nano-hardness ratio of curing degree at 300 C over curing degree at 400 C is 0.89, while the nano-modulus of which is 0.95.

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Section: Methodsmentioning

confidence: 99%

“…The scan resolution is 4 cm À1 and scan number is 16. The general definition of curing rate (thermal imidization) means the percentage of polyimide precursor conversion to polyimide, the calculation method for area intensity is listed as follows: 11,[15][16][17] Relative curing rate…”

Section: Methodsmentioning

confidence: 99%

ATR-FTIR and Nanoindentation Measurements of PMDA-ODA Polyimide Film under Different Curing Temperature

et al. 2007

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“…The curing degree can be determined by the conventional conversion equation. If one peak at 1380 cm À1 band is assigned to C-N stretching vibration of imide ring, and the other peak at 1500 cm À1 band is assigned to C-C stretching vibration of benzene, 28) then the curing degree can be defined as:…”

Section: Ftir Spectra Of Pi Filmmentioning

confidence: 99%

Spin-Coating Polyimide Film on Hydrogenated DLC Film Surface Prepared by Ion Beam Deposition Method

2006

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The present work describes the hybrid layers consisting of 1-mm-thick hydrogenated diamond-like carbon (DLCH) film deposited by ion beam deposition (IBD) method as the bottom layer and spin coating polyimide (PI) film at a thickness of 6 mm as the top layer. Optical microscopy shows that all DLCH film, PI film and PI/DLCH film have smooth surface and are free from cracks or wrinkles. Water contact angle measurement shows that the annealed DLCH film has the higher relative adhesive tension and adhesive work than that of PI film. Raman spectra show that the DLCH film can avoid severe graphitization & degradation at 300 C during annealing treatment, and FTIR spectra also exhibit that the PI film will reach 95% imidization during the curing step at 300 C. PI film can act on DLCH film as the stress buffer. This is demonstrate from warpage measurement showing that top PI film with tensile stress can partially reduce the compressive stress over bottom DLCH film with 6.7% warpage reduction. The electrical resistivity of PI/DLCH/Si is similar to that of PI/Si is resulted from the PI passivation effect.

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“…In addition, it is difficult to fabricate patterns with high resolutions and high-precisions in polyimide films because polyimide is difficult to etch or to dissolve away by a conventional photolithography and etching processes [15][16][17]. Furthermore, fine patterns with rectangular cross-sections and well defined line-edges are difficult to achieve due to a large shrinkage (30 -60%) resulting from the thermal imidization reaction of the polyimide precursor [18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

Suzuki

Youn

Park

et al. 2014

J. Photopol. Sci. Technol.

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In this study, Cu/polyimide multilayer interconnections (dual-damascene) approach based on a UV-assisted thermal nanoimprint technique at every lithography process was demonstrated aiming at developing a low-cost fabrication process for high-density interconnections in polyimide. The dual-damascene process can be simplified by nanoimprint using a multi-tiered mold, and realize fine interconnections using a soluble polyimide block copolymer with a high formability and low shrinkage during a polyimide patterning process. Three-layered Cu/polyimide structures with a minimum wire-width of 5 µm were fabricated in the polyimide by performing subsequent Cu electroplating and chemical mechanical polishing (CMP). The feasibility of the process was thus verified. The electric resistances values of the fabricated three-layered interconnections measured by a four-terminal method showed linear increase as a function of the number of interconnection vias. Heat resistance test at 260 o C which corresponded to reflow soldering process was also evaluated; less than 1.2%-increasing ratio of electric resistance was obtained in the case of 3-cycle heating.

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Residual stress and microstructures of aromatic polyimide with different imidization processes

Cited by 55 publications

References 13 publications

ATR-FTIR and Nanoindentation Measurements of PMDA-ODA Polyimide Film under Different Curing Temperature

ATR-FTIR and Nanoindentation Measurements of PMDA-ODA Polyimide Film under Different Curing Temperature

Spin-Coating Polyimide Film on Hydrogenated DLC Film Surface Prepared by Ion Beam Deposition Method

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

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