Residual stress analysis—an important consideration for coating of stereolithography polymers

Luan, B.; Liu, Xing Yang; Nagata, John; Cheong, Woo-Jae

doi:10.1016/j.surfcoat.2004.07.083

Cited by 18 publications

(11 citation statements)

References 7 publications

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“…They concluded that smaller layer thickness and greater draft angle results in lower ejection force and increased life of the inserts. X-ray diffraction and hole drilling methods were used to analyse the residual stresses of metal coating and SL 5195 (Luan et al, 2005). The literature survey reveals that there are a number of works focusing on surface finish, accuracy, curl distortion and limited works concentrate on mechanical properties.…”

Section: Review Of Literaturementioning

confidence: 99%

Influence of layer thickness on mechanical properties in stereolithography

Chockalingam¹,

Jawahar²,

Chandrasekhar

2006

Rapid Prototyping Journal

145

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -Mechanical properties such as tensile, yield, impact strengths, and development of residual stresses play an important role intooling applications. The objective of this paper is to investigate the effect of layer thickness -one of the influential process parameters in stereolithography (SL) process, on mechanical properties of SL components. Design/methodology/approach -Test specimens are constructed as per the ASTM standards for different layer thicknesses in SL 5000 machine, using epoxy resin CIBA tool w SL5530, a high temperature resistant SL material that is suitable for rapid tooling applications. Tensile, yield and impact tests are carried out with suitable equipments. Residual stress is analysed using hole drill method. Findings -The analysis reveals that when the layer thickness is smaller, the strength of the part is higher. Research limitations/implications -Conclusion of this research is drawn based on the analysis of the most widely used three layer thicknesses of 100, 125 and 150 mm. X-ray diffraction or molecular resonance analysis may be useful to understand the reason for the variation in mechanical properties. Originality/value -This experimental study provides the useful information to the SL machine users in the selection of layer thickness to manufacture rapid tools.

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Section: Review Of Literaturementioning

confidence: 99%

Influence of layer thickness on mechanical properties in stereolithography

Chockalingam¹,

Jawahar²,

Chandrasekhar

2006

Rapid Prototyping Journal

145

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“…24 For example, the nontoxic sodium hypophosphite (NaH 2 PO 2 $H 2 O) is usually used as a reductant to reduce the metal ions (e.g., Cu 2+ , Ni 2+ , Co 2+ and etc. Although this technology has been widely used for the production with uniform, less porous, adherent metal lm in many industrial applications (e.g., printed circuit board industry, [28][29][30] aerospace and automotive industry 31 ), there is no report on the preparation of Fe/Cu bimetallic particles for environmental application by using the electroless plating. [25][26][27] If the Fe/Cu bimetallic particles were prepared by using the electroless plating, the Fe 0 substrates would not be corroded to release plenty of Fe 2+ /Fe 3+ ions, which would facilitate the deposition of Cu on the Fe 0 substrates and enhance the bonding force between Cu and Fe 0 substrates.…”

Section: Introductionmentioning

confidence: 99%

Comparative study on the characteristics, operational life and reactivity of Fe/Cu bimetallic particles prepared by electroless and displacement plating process

Ren

Lai

2016

RSC Adv.

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In this study, an electroless (electrode-less) copper plating technology was developed to prepare the high-reactive and robust iron-copper (Fe/Cu) bimetallic particles. First, effect of pretreatment and key preparation parameters (e.g., complexant, H 3 BO 3 , NiSO 4 $7H 2 O, pH and plating time) on the reactivity of Fe/Cu bimetallic particles were investigated, respectively. Their reactivity was evaluated according to the obtained K obs for PNP removal. Also, the characteristics of Fe/Cu bimetallic particles prepared by electroless plating and displacement plating were comparatively observed by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS). The analysis results show that when Fe/Cu bimetallic particles were prepared by electroless plating, copper was uniformly deposited on the surface of Fe 0 substrate, and only a few bulky particles were observed. However, plenty of loose copper blocks were heterogeneously distributed on the surface of Fe 0 substrates when the Fe/Cu bimetallic particles were prepared by the conventional displacement plating. Furthermore, the operational life and reactivity of Fe/Cu bimetallic particles prepared by electroless and displacement plating process were comparatively investigated by the recycling experiment. The results suggest that the new Fe/Cu bimetallic particles have a longer operational life than that of the conventional Fe/Cu bimetallic particles. Meanwhile, it can be seen from the control experiments that the new Fe/Cu bimetallic particles have a stronger reactivity for the PNP removal both in Fe/Cu/air and Fe/Cu/N 2 processes. As results, the new electroless plating for the preparation of Fe/Cu bimetallic particles is superior to the conventional displacement plating. In other words, the electroless copper plating is a promising technology to prepare the high-reactive and robust Fe/Cu bimetallic particles.

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“…However, their functionality can be enhanced by applying a layer of copper or nickel or their corresponding alloys [82,83].…”

Section: Processesmentioning

confidence: 99%