2022
DOI: 10.6023/a22080347
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Research Progress of Electroless Plating Technology in Chip Manufacturing

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Cited by 4 publications
(2 citation statements)
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“…In IC manufacturing, trace amounts of metal ions and particles in the WECs can negatively impact performances due to the increasingly smaller sizes of fabricated chips. Therefore, metal ions must be completely removed from the solvents . This study leveraged the characteristics of MMMs to remove fine particles and the natural capacity of maifanite for adsorption and selective separation.…”
Section: Resultsmentioning
confidence: 99%
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“…In IC manufacturing, trace amounts of metal ions and particles in the WECs can negatively impact performances due to the increasingly smaller sizes of fabricated chips. Therefore, metal ions must be completely removed from the solvents . This study leveraged the characteristics of MMMs to remove fine particles and the natural capacity of maifanite for adsorption and selective separation.…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, metal ions must be completely removed from the solvents. 45 This study leveraged the characteristics of MMMs to remove fine particles and the natural capacity of maifanite for adsorption and selective separation. The prepared TFN membranes with crosslinked dense mesh structures achieved the complete removal of various metal ions.…”
Section: Ion Removal Abilitymentioning
confidence: 99%