Research progress in insulating and thermal conductivity of fluorinated graphene and its polyimide composites

Abstract

The demand for innovative thermal management materials with superior thermal conductivity and electrical insulating properties has significantly increased with the development of portable and flexible electronic gadgets. Fluorinated graphene (FG) has recently attracted the attention of the scientific community because of its exceptional thermal conductivity and electrical insulating qualities. This work aims to provide a detailed analysis of the structure‐property relationships inherent in FG, including both chemical and physical properties, and to explain the FG manufacturing process. Special attention should be paid to a thorough analysis of the thermodynamic conduction mechanism exhibited by FG, including the effects of corrugation size, fluorine coverage, and fluorine atom distribution on its thermal conductivity. The essay also examines in‐depth the most current and cutting‐edge developments addressing the utilisation of FG as a functional filler in composite‐modified polyimide (PI) materials. Furthermore, it has been noted as a crucial component in answering the needs for possible applications by maximising thermal conductivity and mechanical qualities in FG/PI composites through particular FG structural engineering and increased FG‐PI interaction. As a result, these elements serve as the main focus of ongoing research projects, highlighting important directions for development and investigation.

Preparation and Properties of Low-Dielectric Polyimide Films Containing Tert-Butyl

“…With the rapid development of the microelectronics industry, the requirements for low-dielectric and low-energy-consumption devices are increasing, wherein interlayer dielectric materials are crucial in electronic devices [1][2][3][4][5]. In this context, low-dielectric materials have attracted much interest.…”