Research on Ultrasonic-Assisted Grinding Process of SiCp/Al Composites

Abstract

SiCp/Al is a kind of particle reinforced composites with good material properties, which can be used in the field of lightweight parts and electronic packaging. Ultrasonic- assisted grinding process is one of the processes which is suitable for machining hard and brittle materials, the surface quality can be improved by using appropriate ultrasonic-assisted process parameters. In this paper, the ultrasonic-assisted grinding process is used to improve the surface quality of SiCp/Al, meanwhile, the kinematics of abrasive particles in grinding is analysed to explain the effect of ultrasonic vibration. In addition, ultrasonic-assisted grinding experiment of SiCp/Al is conducted, it is found that the axial ultrasonic vibration can improve the surface quality of SiCp/Al in grinding, and the reduction percentage is up to 8.20% compared to the normal grinding. In addition, a regression model is proposed for surface roughness prediction, the result of t-test on the residuals shows that the model is accurate.