Research on the solder joint image segmentation based on the improved spatial fuzzy C means algorithm

Li, Meng-xiao; Wan, Yizao

doi:10.1109/fskd.2016.7603476

Cited by 2 publications

(2 citation statements)

References 3 publications

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“…21 to overcome the illumination variations and background disturbance. Li and Wan 15 proposed an improved solder joint segmentation method based on the spatial fuzzy C means algorithm. Although these methods can be e®ective at locating solder joints, but only if welding them one by one, they cannot meet the requirements of locating the solder joints of the entire image at the same time and still have a high precision.…”

Section: Related Workmentioning

confidence: 99%

“…Although these methods can be e®ective at locating solder joints, but only if welding them one by one, they cannot meet the requirements of locating the solder joints of the entire image at the same time and still have a high precision. 2,[5][6][7]9,10,[15][16][17][19][20][21]24,[33][34][35][36][37][38][39][40] Combined with the characteristics of the small PCB size, the large number of solder joints, the small single spot area and the compressed welded, the traditional methods mentioned classify and locate the solder joints one by one so that they are not suitable for the extraction of various solder joints. 3,14,26,28,30,32 Compared with existing works on PCB solder joint extraction and inspection, the novelty and advantages from this paper are as follows:…”

Section: Related Workmentioning

confidence: 99%

See 1 more Smart Citation

A Novel Multi-Pattern Solder Joint Simultaneous Segmentation Algorithm for PCB Selective Packaging Systems

Huang

Shen

Xie

et al. 2019

Int. J. Patt. Recogn. Artif. Intell.

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To prevent any negative electromagnetic influence of high-density integrated circuits, an insulation package needs to be specially designed to shield it. Aiming at the low efficiency and material waste in traditional packaging methods, a printed circuit board (PCB) selective packaging system based on a multi-pattern solder joint simultaneous segmentation algorithm and three-dimensional printing technology is introduced in this paper. Firstly, the structure of PCB selective packaging system is designed. Secondly, to solve the existing problems, such as multi-pattern solder joints which are located densely in small welding areas and are hard to be extracted in the small-area integrated circuit board, a multi-pattern solder joint simultaneous segmentation algorithm is developed based on (geometrical) neighborhood features to extract and locate the optimal PCB solder joint areas. Finally, tests using three actual PCB are carried out to compare the proposed method with traditional multi-threshold solder joint extraction methods. Test results indicate that the proposed algorithm is simple and effective. Diverse solder joints can be optimally located and simultaneously extracted from the collected PCB image, which greatly improves the filling rate of the solder joint areas and filters out false pixels. Thus, this method provides a reliable location-finding tool to help place solder points in PCB selective packaging systems.

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Section: Related Workmentioning

confidence: 99%