Research on the Package of High Voltage SiC JBS

Abstract

According to the application of the high voltage SiC devices, studying the package of three kinds of SiC dies with different metals. Experiments show that all die wire bonding and shear strength measurement up to standard, and provide three kinds of packages for different applications, at the same time, filling the needs of producing. The purpose of the shear strength test is to determine the integrity of materials used to attach SiC die to package substrates.