Research on the influence of parallel seam welding parameters on the reliability of thin-walled ceramic package

Yang, Zhentao; Chen, Jiangtao; Liu, Lin-jie; Shi, Peng-yuan

doi:10.1109/icept56209.2022.9873244

Cited by 4 publications

(2 citation statements)

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“…The surface welding area was uniformly divided into multiple geometric subunits, and the PSW process was simulated by progressively applying Joule heating to the welding area. Furthermore, many subsequent studies have extended this coupling approach and applied it to investigate additional physical phenomena [18,19]. For example, Huang et al [20] studied the stress evolution in parallel seam welding using the moving heat source method by controlling the number of cut-cover plate edges and the duration of the heat source action.…”

Section: Introductionmentioning

confidence: 99%

Analysis of the Parallel Seam Welding Process by Developing a Directly Coupled Multiphysics Simulation Model

Lin,

Qin,

Gong

et al. 2023

Processes

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Parallel seam welding (PSW) is the most commonly employed encapsulation technology to ensure hermetic sealing and to safeguard sensitive electronic components. However, the PSW process is complicated by the presence of multiphysical phenomena and nonlinear contact problems, making the analysis of the dynamics of the PSW process highly challenging. This paper proposes a multiphysics simulation model based on direct coupling, enabling the concurrent coupling of the electric field, temperature field, and structural field to facilitate the analysis of the thermal and electrical dynamics within the PSW process. First, this paper conducts an in-depth theoretical analysis of thermal and electrical contact interactions at all contact interfaces within the PSW process, taking into account material properties related to temperature. Second, the acquired data are integrated into a geometric model encompassing electrode wheels and ceramic packaging components, facilitating a strongly coupled multiphysics simulation. Finally, the experimental results show that the simulated weld area deviates by approximately 6.5% from the actual values, and the highest component temperature in the model exhibits an approximate 10.8% difference from the actual values, thus validating the accuracy of the model. This directly coupled multiphysics simulation model provides essentially a powerful tool for analyzing the dynamic processes in the PSW process.

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Section: Introductionmentioning

confidence: 99%

Analysis of the Parallel Seam Welding Process by Developing a Directly Coupled Multiphysics Simulation Model

Lin,

Qin,

Gong

et al. 2023

Processes

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show abstract

“…Ceramic material products have developed rapidly in recent years and have been widely used in many fields [1][2][3][4][5][6][7][8]. Ceramic package products have high packaging density, good electrical and thermal performance, and high reliability [9,10]. Compared with plastic and metal materials, they have obvious advantages in packaging, including good air tightness, high thermal conductivity, difficulty producing micro-cracks, and high-temperature tolerance.…”

Section: Introductionmentioning

confidence: 99%

A Ku-Band Miniaturized System-in-Package Using HTCC for Radar Transceiver Module Application

Yang

Zhang²,

Song³

2022

Micromachines

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This paper introduces a miniaturized system in package (SIP) for a Ku-band four-channel RF transceiver front-end. The SIP adopts the packaging scheme of an inner heat-dissipation gasket and multi-layer substrate in the high temperature co-fired ceramics (HTCC) shell with a metal heat sink at the bottom. The gasket effectively solves the heat-dissipation problem of high-power transceiver chips, and the multi-layer substrate achieves the interconnection between multiple chips. Within the limited size of 14.0 × 14.0 × 2.5 mm3, the SIP integrates five bidirectional amplifier chips, an amplitude-phase control multi-function chip, and two power modulation chips to realize the Ku-band four-channel RF transceiver front-end. Transmitting power over 0.5 W (27dBm) and receiving noise figure of 3.4 dB are achieved in the Ku-band. The efficient heat dissipation, high air tightness, and excellent integration are simultaneously realized in this SIP. The measurement results show that the performance is stable in the receiving and transmitting states, and the SIP based on HTCC technology has specific prospects for radar transceiver application.

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Failure analysis and reliability improvement of large-size parallel seam welding package

Wu,

Cao,

Wang

et al. 2023

2023 24th International Conference on Electronic Packaging Technology (ICEPT)

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Research on the influence of parallel seam welding parameters on the reliability of thin-walled ceramic package

Cited by 4 publications

References 0 publications

Analysis of the Parallel Seam Welding Process by Developing a Directly Coupled Multiphysics Simulation Model

Analysis of the Parallel Seam Welding Process by Developing a Directly Coupled Multiphysics Simulation Model

A Ku-Band Miniaturized System-in-Package Using HTCC for Radar Transceiver Module Application

Failure analysis and reliability improvement of large-size parallel seam welding package

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