Research on the Humidity Resistance Reliability of Different Packaging Structures

Xuan, Hui; Yu, Zheng; Wu, Hua; Ding, Wanchun; Gao, Guohua

doi:10.1109/icept52650.2021.9567979

Search citation statements

Order By: Relevance

Paper Sections

Select...

Introduction1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2022

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Sometimes the working environment of circuits is very harsh, such as high temperature and high humidity, vibration, salt spray, etc., which may degrade or even fail electronic package, including ball grid array [11,12,13,14,15,16]. With regard to research on mechanical/material reliability of BGA operating in harsh environment.…”

Section: Introductionmentioning

confidence: 99%

Impact of ground solder ball failure in BGA package on near electric field radiation

Yuan

Zhang

Wang

et al. 2022

IEICE Electron. Express

View full text Add to dashboard Cite

In this paper, the impact of ground solder ball failure in ball grid array (BGA) package on near electric field radiation was investigated from the perspectives of both theoretical modelling and experimental testing. Based on the structural and material parameters, a 3D electromagnetic field numerical calculation model of circuit boards with failed ground solder balls was developed. The influences of both different number of failed ground solder balls and different signal frequencies on near electric field radiation was calculated. The electromagnetic field model results are validated using experimental tests.

show abstract