2014
DOI: 10.3788/aos201434.1123002
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Research on the Heat-Release Performance of High Power LED Using Slotted Plate

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“…Computer numerical simulation technology is an important method for thermal simulation and integrated circuit design. [16] According to Christensen, [17] the heat dissipation performance of LED modules that include a single Lambertian LED and a single chip-on-board (COB) packaged ceramic substrate under different heat dissipation conditions was inves-tigated using the finite element method. In this study, a computational model was used to simulate the Philips (E27ES) LED filament bulb.…”
Section: Introductionmentioning
confidence: 99%
“…Computer numerical simulation technology is an important method for thermal simulation and integrated circuit design. [16] According to Christensen, [17] the heat dissipation performance of LED modules that include a single Lambertian LED and a single chip-on-board (COB) packaged ceramic substrate under different heat dissipation conditions was inves-tigated using the finite element method. In this study, a computational model was used to simulate the Philips (E27ES) LED filament bulb.…”
Section: Introductionmentioning
confidence: 99%