Research on the distributed circuit parameters of the chamfered bent microstrip line

Zhang, Hui; Li, Zengrui; Wang, Junhong

doi:10.1109/icmmt.2010.5524809

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2012

2022

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Cited by 3 publications

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“…The microstrip is routed using straight lines and 45 degree chamfered bends. Chamfered bends are a standard microstrip routing technique and it can be shown that they are an improvement over 90 degree bends [7] [8] reducing reflections and impedance discontinuities caused by abrupt bending. Modeling of these bends are also natively supported by the modeling software used in this study.…”

Section: Substrate Layoutmentioning

confidence: 99%

Modeling and simulation of packaging substrate effects on radio frequency integrated circuits

Benedik

Ren

2012

2012 IEEE National Aerospace and Electronics Conference (NAECON)

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In this paper an analysis of the effects of integrated circuit packaging substrates on a radio frequency (RF) IC is presented. At RF frequencies the effects of packaging parasitics become crucial when assembling an RF system in package (SiP) or integrating a single die with a package. A differential buffer, which had been previously fabricated in a 90nm CMOS process is used as a vehicle to analyze the effects of packaging on performance. The integration of the buffer die with the package is modeled and analyzed.

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Section: Substrate Layoutmentioning

confidence: 99%