Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing

Abstract

This paper studies the AWC (Active Wafer Centering) algorithm for the movement control and wafer calibration of the handling robot in semiconductor manufacturing to prevent wafer surface contact and contamination during the transfer process. The mechanical and software architecture of the wafer-handling robot is analyzed first, which is followed by a description of the experimental platform for semiconductor manufacturing methods. Secondly, the article utilizes the geometric method to analyze the kinematics of the semiconductor robot, and it decouples the motion control of the robot body from the polar coordinates and joint space. The wafer center position is calibrated using the generalized least-square inverse method for AWC correction. The AWC algorithm is divided into calibration, deviation correction, and retraction detection. These are determined by analyzing the robot’s wafer calibration process. In conclusion, the semiconductor robot’s motion control and AWC algorithm are verified through experiments for correctness, feasibility, and effectiveness. After the wafer correction, the precision of AWC is <± 0.15 mm, which meets the requirements for transferring robot wafers.

Ultra-High Frequency Surface Acoustic Wave Sensors for Temperature Detection

“…After the SAW devices are prepared and packaged, they ought to be tested with a network analyzer (Figure 3a) to see if the response matches the design values, such as center frequency, insertion loss, and delay time. Due to the tiny size of the UHF SAW sensors, the network analyzer was used in conjunction with a microwave probe station [24]. As shown in Figure 3b, the microwave probe was fixed on the probe stage through After the metal electrode was identified as gold, the effect of different gold film thicknesses on the SAW was explored.…”