2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2021
DOI: 10.1109/therminic52472.2021.9626474
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Research on Heat Dissipation Performance and Long-term Reliability of the Flapping Wing Cooling Technology Applied to the 5G Communications Equipment

Guo Yan-hua
1
,
Xianming Zhang
2
,
Dai-Yan Lan
3
et al.
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