Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology

Zhang, Ke Ke; Wang, Yao Li; Fan, Yan Li; Yiang, Jie; Yan, Yan Fu; Zhang, Xin

doi:10.4028/0-87849-456-1.2912

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2012

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“…[2][3][4] The preceding studies reveal that adding 0?1% rare earth (RE) in the solder can enhance the physical properties and creep strength of SnAgCu solder alloys. 5 In order to further improve the wettability, tensile strength and elongation of SnAgCuRE lead free solder, minor Ni has been added into the solder during manufacturing. [6][7][8] As is well known, the formation of intermetallic compound (IMC) at the solder/substrate interface would affect the reliability of the solder joint.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

Zhang¹,

Qiu³

et al. 2012

Materials Science and Technology

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Aging treatment was implemented for the Sn2·5Ag0·7Cu0·1RExNi/Cu solder joint under various temperatures simulating the service environment. The growing behaviour of the intermetallic compound at the soldering interface during aging was investigated. In the case of adding 0·1Ni aged solder joint, the maximum growth activation energies of (Cu,Ni)6Sn5 and Cu3Sn are 86·8 and 93·7 kJ mol−1 respectively. The results reveal that the growth of intermetallic compound in the soldering interface can be suppressed, and the solder joint can be strengthened by adding proper quantities of Ni in the solder.

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