Research on creep mechanical properties of flexible screen functional film layer

Abstract

The creep behavior of AMOLED flexible screens is a crucial consideration in the design and manufacturing processes. Various factors impact the creep process of AMOLED modules in thermoplastic polymers. However, experimental work typically only focuses on sustained stress over time at room temperature, neglecting other factors affecting creep strain. It is essential to explore the influence of creep on the bending performance of flexible AMOLED modules and analyze the creep curves of each film layer for the bending of flexible screens. Furthermore, the analysis includes the examination of the influence of the thickness and elastic modulus of the protective cover plate and support plate on screen bending at different temperatures, along with further creep analysis of the protective cover plate and the support plate. The mechanical exploration of the protective cover plate and support plate under 6-9 h creep response was analyzed, and the influence of the protective cover plate and support plate on screen bending performance was analyzed. We conduct stress-strain analysis on the protective cover plate at different temperatures (-40~120°C). Before the temperature increases to 80°C, the stress and strain increase with the increase of temperature, and after the temperature reaches 80°C, the stress and strain decrease with the increase of temperature. The temperature of the protective cover plate is 20°C, and the risk of bending failure is relatively low. The creep analysis of the support plate shows a small difference in the fracture strength between the support plate undergoing creep and the fracture strength not undergoing creep. The fracture elongation of the support plate at 20°C is 0.52%, and the fracture strength is 106 MPa. The fracture elongation of the support plate after heating also increases.