Abstract:The paper deals with the study of interaction between Cu, Al substrates (purity 5N) and ZnAl4, ZnAg6Al6 zinc solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420 °C. Acting time of ultrasonic vibration was 3 s and ultrasound frequency was 40 kHz. Soldered joints were assessed by optical light microscopy and EDX microanalysis. Intermetallic layers (IM) CuZn4 and Cu5Zn8 were formed at the Cu/ZnAl4 boundary. The βZn-αAl m… Show more
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