2021
DOI: 10.20944/preprints202106.0548.v1
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Research into the Disintegration of Abrasive Materials in the Abrasive Water Jet Machining Process

Abstract: The size and distribution of abrasive particles have a significant influence on the effectiveness of the cutting process by the high-speed abrasive water jet (AWJ). The paper deal with the abrasive materials disintegration intensity in AWJ cutting during the creation of the abrasive jet. An evaluation of the abrasive materials grabbed after forming in the cutting head was carried out and its grain distribution was evaluated. Used here the arithmetic, geometric and logarithmic method of moments and Folk and War… Show more

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Cited by 14 publications
(2 citation statements)
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“…The high flash point temperature during tribochemical mechanical polishing will stimulate the occurrence of the above formula (3) -(5) [41]. On the other hand, the flash point temperature during polishing will also promote the reaction between water molecules and oxygen in the air and Cr2O3, as shown in formula (6). In formula ( 6), OHionized by the product absorbing water molecules in the air and silicon bond suspended in silicon carbide will undergo tribochemical reaction [42,43], the reaction is shown in formula (7).…”
Section: Sic+2o2→sio2+co2↑mentioning
confidence: 99%
See 1 more Smart Citation
“…The high flash point temperature during tribochemical mechanical polishing will stimulate the occurrence of the above formula (3) -(5) [41]. On the other hand, the flash point temperature during polishing will also promote the reaction between water molecules and oxygen in the air and Cr2O3, as shown in formula (6). In formula ( 6), OHionized by the product absorbing water molecules in the air and silicon bond suspended in silicon carbide will undergo tribochemical reaction [42,43], the reaction is shown in formula (7).…”
Section: Sic+2o2→sio2+co2↑mentioning
confidence: 99%
“…Chemical mechanical polishing is a technology to realize ultra-precision machining [4,5]. Abrasive plays a very important role in chemical mechanical polishing, and often were used in the processing of semiconductor materials, aerospace and other fields [6][7][8]. In recent years, many scholars have studied different abrasives, such as magnetic abrasives, mixed abrasives, polycrystalline diamond abrasives etc [9][10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%