Research and Prospect of Diamond/Aluminum Matrix Composites

Abstract

Diamond/aluminum matrix composite with high thermal conductivity is of great significance to solve the heat dissipation problem of large-scale integrated circuits and high-power components. This paper reviews the current research status of diamond/aluminum matrix composites, and analyzes the effects of the preparation and processing of the composites, the interface bonding between diamond and aluminum matrix, the reinforced diamond and matrix alloy elements on the properties of the composites.