Research and analysis of voids in semiconductor laser diode packaging reflow soldering

Abstract

The causes of voids in the soldering layer during vacuum reflow soldering of semiconductor laser devices are investigated, as are the movement and change laws of bubbles in the voids under different reflow chamber settings. An ultrasonic scanner is used to test and experiment with a series of 1064 nm wavelength semiconductor lasers. A technique for detecting the void rate based on the wavelength difference is proposed based on the association between the device wavelength, junction temperature, and voids. The average void rate error when comparing measured and calculated values is just 1.5%, demonstrating the validity of this estimation technique for defining the void rate of the device and providing a theoretical and practical reference to analyze the void rate of the device.

The research on the application of self-propagating interconnection technology in silicon optical transceiver module for aerospace

“…Under the influence of harsh environments and high-power devices, the thermal performance of industrial optical modules cannot meet the requirements of aerospace applications based on the dispensing process. For traditional eutectic bonding, it is common to have an entire bonding structure exposed to a high temperature to ensure strong and reliable bonding (Fauzi et al , 2022; Xu et al , 2022; Guo et al , 2022; Yadav et al , 2022). In large-area bonding, because of the mismatched coefficients of thermal expansion (CTE) of different materials couple, the warpage of different materials is different which leads to pseudo soldering (Grieseler et al , 2012; Mueller and Franke, 2014).…”