2011
DOI: 10.1016/j.compositesa.2011.04.013
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Representativity of thermal stresses in designing composite joints based on singular stress states at multimaterial corners

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Cited by 12 publications
(8 citation statements)
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“…( 22) from equation ( 21) tends to overestimate the residual stress values, as pointed out by [226] and also observed experimentally in . [227] In [227] two simple experiments were conducted to check the potential residual stress field developed in the cooling stage of the curing process. A composite-metal single-lap joint was bonded using an adhesive curing at T c = 115°C.…”
Section: Additional Considerationsmentioning
confidence: 99%
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“…( 22) from equation ( 21) tends to overestimate the residual stress values, as pointed out by [226] and also observed experimentally in . [227] In [227] two simple experiments were conducted to check the potential residual stress field developed in the cooling stage of the curing process. A composite-metal single-lap joint was bonded using an adhesive curing at T c = 115°C.…”
Section: Additional Considerationsmentioning
confidence: 99%
“…The stress fields are completely different when considering the expected ΔT = T c -T amb = 115-25 = 90°C than those obtained when considering lower ΔT values. This lower ΔT are completely equivalent to testing the joint at temperatures above the room temperature, and those test were carried out in [227] finding absolutely no significant influence in the failure load or failure path (considering detailed failure path observations at the critical part of the joint). These experimental findings indicate that the expected residual stress profile has not fully developed, maybe due to the relaxation effects mentioned in [225] in presence of high stress gradients and to the viscoelastic behaviour of the adhesive.…”
Section: Additional Considerationsmentioning
confidence: 99%
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“…By utilizing the Stroh formalism, Hwu and Lee derived analytically a closed‐form solution for the orders of stress and heat flux, together with the temperature, displacement, and stress fields of multibonded anisotropic wedges. Barroso et al and Nomura et al investigated numerically the singular stress states near the vertex of multimaterial corners under thermal loading. Abe et al calculated the stress intensity factor of interfacial corner between anisotropic piezoelectric multimaterials using a combination of the Stroh formalism and the Williams eigenfunction method.…”
Section: Introductionmentioning
confidence: 99%
“…Although thermal stresses have been reported to have a significant influence on the behaviour of adhesive joints between dissimilar materials [21], the stresses being actually more severe in the Double Lap Joint (DLJ) than in the BT specimen, thermal analysis has not been included in the present work, following previous experience in similar corner geometries [22].…”
Section: Introductionmentioning
confidence: 99%