Repeated Testing Applications for Improving the IC Test Quality to Achieve Zero Defect Product Requirements

Yeh, Chung-Huang; Chen, Jwu E.

doi:10.1007/s10836-019-05812-0

Cited by 14 publications

(13 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Manta et al studied the statistical quality control method for the validation of the immunochromatographic rapid detection kit based on gold nanoparticles [4]. Yeh and Chen improved the test quality of integrated circuits to achieve the repeated test application of zero defect product requirements [5]. Te research of quality testing mostly focuses on the methods and strategies of quality control, and there is little research on noncontact instruments.…”

Section: Introductionmentioning

confidence: 99%

Quality Control Strategy and Evaluation Algorithm for Noncontact Instrument Testing

Xue

Tang

2023

International Transactions on Electrical Energy Systems

View full text Add to dashboard Cite

The test quality of noncontact instruments is an important issue that has aroused social concern at present, which is also widely used in the power quality management of telecommunication systems. The fuzzy logic algorithm can be used in power quality testing to analyze the power quality of electrical equipment. Based on the advantage of the fuzzy logic algorithm, this paper studied the quality control strategy and evaluation algorithm of noncontact instrument testing and drew a conclusion. In terms of the investigation on the safety of power quality measurement, it was concluded that the method of noncontact instrument testing power quality improved the safety of voltage quality, current quality, power supply quality, and power consumption quality. In the investigation of the accuracy of the power quality measurement, it was concluded that the noncontact instrument was used to measure power quality, which greatly improved the accuracy of measurement. In terms of the investigation on the rapidity of the power quality measurement, it was concluded that the use of the noncontact instrument to test power quality could greatly improve the rapidity of current quality measurement and that the rapidity of the power quality measurement could be improved by more than 70%. In the aspect of economic investigation of the power quality measurement, it was concluded that the use of the noncontact instrument to test power quality could greatly improve the economic efficiency of the power quality measurement. In the aspect of fuzzy logic evaluation in power quality management, it was concluded that most of the power quality grades of the selected research objects were excellent. Therefore, the fuzzy logic method was very meaningful for power quality evaluation.

show abstract

Section: Introductionmentioning

confidence: 99%

Quality Control Strategy and Evaluation Algorithm for Noncontact Instrument Testing

Xue

Tang

2023

International Transactions on Electrical Energy Systems

View full text Add to dashboard Cite

show abstract

“…Due to uncertainty factors in the manufacturing environment (mask error, etching and chemical concentration errors) after manufacturing, we assume the chip delay time of a device under test (DUT) is normal. Therefore, chip(x) = N(x; µ M , σ M ) with mean µ M and standard deviation σ M [2][3][4]:…”

Section: Calculating Manufacturing Yield (Y M ) and Predicting Manufacturing Progress Variationmentioning

confidence: 99%

“…From this third test, only the FPP parts (those previously failed chips that passed the second and third rounds) are reserved. We call this method "unbalance testing," a triple-test (M 3+ Un ) scheme [1][2][3][4], and the (M 3+ Un ) formula is defined as…”

Section: New Unbalanced Testing Schemementioning

confidence: 99%

“…Thus, estimating future product distribution trends using current manufacturing capability and existing product electrical characteristic parameters and conditions is a critical topic. In this study, we used a digital integrated-circuit (DITM) test model [1][2][3][4] using the existing manufacturing technology along with the electrical performance of existing products to estimate the future distribution trend of IC products. According to an update to the International Technology Roadmap for Semiconductors (ITRS), manufacturing speed and testing progress will significantly change in the future, with product manufacturability increasing by 30% annually and testing abilities rising by 12% annually [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Unbalanced-Tests to the Improvement of Yield and Quality

Yeh

Chen

2021

Electronics

Self Cite

View full text Add to dashboard Cite

An integrated-circuit testing model (DITM) is used to describe various factors that affect test yield during a test process. We used a probability distribution model to evaluate test yield and quality and introduced a threshold test and a guardband test. As a result of the development speed of the semiconductor manufacturing industry in the future being unpredictable, we use electrical properties of existing products and the current manufacturing technology to estimate future product-distribution trends. In the development of very-large-scale integration (VLSI) testing, the progress of testing technology is very slow. To improve product testing yield and quality, we change the test method and propose an unbalanced-test method, leading to improvements in test results. The calculation using our proposed model and data estimated by the product published by the IEEE International Roadmap for Devices and Systems (IRDS, 2017) proves that the proposed unbalanced-test method can greatly improve test yield and quality and achieve the goal of high-quality, near-zero-defect products.

show abstract

“…This paper quantifies the process of wafer fabrication and testing assuming that the characteristics of wafer products are normally distributed and applies the digital integrated circuit test model (DITM) [ 1 – 4 ] to estimate the test yield (Y t ) and quality of integrated circuit (IC) products. The rate of progress in future manufacturing is unpredictable.…”

Section: Introductionmentioning

confidence: 99%