Abstract:Timely repair of fused silica damage ensures the stable operation of high-power laser systems. In the traditional repair process, the material nearby the damaged area is gradually ablated with CO2 or femtosecond laser. Subsequently, homogenization and residual stress removal are required because of the microcracks and thermal accumulation generated with the ablation. As a result, the repair efficiency is greatly restricted. In this paper, a new method using in-volume, selective femtosecond laser-induced etchin… Show more