2018
DOI: 10.1016/j.surfcoat.2018.08.080
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Removing overhang and increasing atom re-deposition of sputtering to enable gap-filling scalability

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“…Moreover, recent studies have disclosed that PCM may not fully fill nanosized active regions initially due to void and overhang generated after deposition. [ 58 , 59 , 60 ] Thus, in this work, the interest is in the utilization of PC systems in different as‐fabricated states/conditions as the entropy source for PUF design.…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, recent studies have disclosed that PCM may not fully fill nanosized active regions initially due to void and overhang generated after deposition. [ 58 , 59 , 60 ] Thus, in this work, the interest is in the utilization of PC systems in different as‐fabricated states/conditions as the entropy source for PUF design.…”
Section: Resultsmentioning
confidence: 99%