1995
DOI: 10.1021/cm00055a020
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Remote Hydrogen Plasma Chemical Vapor Deposition of Amorphous Hydrogenated Silicon-Carbon Films from an Organosilane Molecular Cluster as a Novel Single-Source Precursor: Structure, Growth Mechanism, and Properties of the Deposit

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Cited by 57 publications
(78 citation statements)
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“…2) and the resulting near-zero value of the apparent thermal activation energy, E a , calculated from the slope of the Arrhenius plot suggests that film growth is independent of the substrate temperature, and the rate of the process is mass transport-limited. Similar results, showing E a ¼ 0, are reported for RHP-CVD from the dimethylsilane, [6,9] trimethylsilane, [6,9] hexamethyldisilane, [3,5,6,9,12] and tetrakis(trimethylsilyl)silane [2,4,5] precursors.…”
Section: Effect Of Thermal Activationsupporting
confidence: 83%
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“…2) and the resulting near-zero value of the apparent thermal activation energy, E a , calculated from the slope of the Arrhenius plot suggests that film growth is independent of the substrate temperature, and the rate of the process is mass transport-limited. Similar results, showing E a ¼ 0, are reported for RHP-CVD from the dimethylsilane, [6,9] trimethylsilane, [6,9] hexamethyldisilane, [3,5,6,9,12] and tetrakis(trimethylsilyl)silane [2,4,5] precursors.…”
Section: Effect Of Thermal Activationsupporting
confidence: 83%
“…To characterize the reactivity of particular bonds in a TrES molecule with atomic hydrogen, we performed RHP-CVD experiments, also using tetraethylsilane (TES), Et 4 Si, as a model compound representing the Si-C, C-C, and C-H bonds. To avoid an undesirable effect which might arise from the thermochemical reactions the experiments were carried out on unheated substrates.…”
Section: Reactivity Of the Precursor And Yield Of Rhp-cvdmentioning
confidence: 99%
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“…The first may be etching of the glass walls of the CVD system by atomic hydrogen, resulting in incorporation of oxygencontaining etch products into the growing film. [13] The second source may arise from the reactions of long-lived dangling bonds in the deposit with atmospheric oxygen or moisture, which may occur after the film is exposed to the ambient environment. Although some effect of low-level reactor leaking on the oxygen content can not be excluded, two previously mentioned oxygen sources seem to predominate.…”
mentioning
confidence: 99%