Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient

“…This bonding technology that is based on the formation of interfacial IMCs is also known as transient liquid phase (TLP) bonding method [9]. In recent years, many investigators have been reported several common SLID bonding methods by using Cu, Ni, Au or Ag as base metal and In or Sn solders as interlayers to form the symmetrical structures of Cu/Sn/Cu, Cu/ In/Cu, Ni/Sn/Ni, Ag/Sn/Ag and Au/In/Au [10][11][12][13][14]. During SLID bonding, these symmetrical structures will eventually Available online at http:// link.…”

Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging

“…The emergence of through silicon via (TSV) can effectively solve the problems faced by traditional interconnect methods. Microsystems using TSV technology have the following advantages (Tian et al , 2020; Li et al , 2020; Reddy et al , 2020): Heterogeneous integration, TSV can realize the vertical connection of diverse chip electrical signals, which becomes a system with a high degree of heterogeneity. Low power consumption, TSV technology uses vertical short interconnects between layers of chips, which significantly reduces the number and length of interconnections, thereby greatly reducing the power consumption of the system. Low latency, TSV technology shortens the unit interconnection due to the length, thereby reducing the signal delay of the system. …”

“…The emergence of through silicon via (TSV) can effectively solve the problems faced by traditional interconnect methods. Microsystems using TSV technology have the following advantages (Tian et al, 2020;Li et al, 2020;Reddy et al, 2020):…”