First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP &Amp;
DOI: 10.1109/polytr.2001.973258
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Reliability studies of an isotropic electrically conductive adhesive

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Cited by 8 publications
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“…the increased/decreased conductance parallel/ perpendicular to current flow. Morris et al (2001) show the resistance of a z-axis contact as it is mechanically thinned, with a sharp drop in resistivity when the aligned surface layer is removed.…”
Section: Structurementioning
confidence: 99%
See 3 more Smart Citations
“…the increased/decreased conductance parallel/ perpendicular to current flow. Morris et al (2001) show the resistance of a z-axis contact as it is mechanically thinned, with a sharp drop in resistivity when the aligned surface layer is removed.…”
Section: Structurementioning
confidence: 99%
“…It is necessary to separate contact resistance and the bulk composite resistivity in order to interpret physical effects on each, independently (see below), by the subtraction of the common four-terminal measurement, which removes test lead and contact effects, from a three-terminal measurement which includes one contact in the test current path (Morris et al, 2001;Klosterman et al, 1998).…”
Section: Electrical Propertiesmentioning
confidence: 99%
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“…Adhesives are preferable whenever high elasticity is needed to compensate for thermal expansion mismatch between substrate and component body [19][20][21][22]. However, compared to soldering, electrically conductive adhesive technology is still in its infancy [23,24]. Two critical issues of conductive adhesives for surface mount applications are the contact resistance shift during lifetime and a low impact performance [25].…”
Section: Introduction and Historical Backgroundmentioning
confidence: 99%