2006 IEEE International Reliability Physics Symposium Proceedings 2006
DOI: 10.1109/relphy.2006.251234
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Reliability Qualification of CoSi2 Electrical Fuse for 90Nm Technology

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Cited by 15 publications
(9 citation statements)
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“…It has also been observed that a large amount of metal atoms electromigrate away even from the cathodes of p-fuses under strong pulsed current conditions [8], [10]. Therefore, it can be said that the subsidiary EM event also occurs at the edge of the silicided layer near the right side (dotted-line arrows).…”
Section: ) Model For the Firstmentioning
confidence: 99%
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“…It has also been observed that a large amount of metal atoms electromigrate away even from the cathodes of p-fuses under strong pulsed current conditions [8], [10]. Therefore, it can be said that the subsidiary EM event also occurs at the edge of the silicided layer near the right side (dotted-line arrows).…”
Section: ) Model For the Firstmentioning
confidence: 99%
“…During EM, the metal atoms move from around the cathode end of the link toward the opposite anode end [3]. It has been known that intensive EM causes a large amount of metal atoms to move from the cathode [8], [10], and the metal often accumulates near the anode end. Within the two-step programming under moderate programming condition [4], after EM, drastic changes such as melting are thought to occur in the poly-Si layer below the broken link of the upper silicided layer.…”
Section: Introductionmentioning
confidence: 99%
“…A typical implementation is a poly (or Cu) fuse, where Joule heating is used to melt metal link and resulting resistance change is sensed by using a latch as shown in Fig. 1a [1][2][3][4][5][6][7][8][9][10][11]. Anti-fuse is one of the candidates for e-fuse [12][13][14].…”
Section: Introductionmentioning
confidence: 99%
“…In addition to the FPGA and antifuse technique, the electrical fuse (eFUSE) is another candidate for reconfigurable logic applications [4]- [6]. However, eFUSE takes up a large area and requires a high current to blow the fuse.…”
Section: Introductionmentioning
confidence: 99%