Reliability of Various Types of Wafer Level Package (WLP) for Mobile Application

Jung, Gi-Jo; Park, Yun-Mook; Kang, Insoo; Jeon, Byoung-Yool; Kim, Sung‐Dong; Ahn, Hyo-Sok; Huh, Young-Jung; Jo, Kyoung-Chul; Heo, Gil; Park, Hee-Jun; Kim, Se-Ryoung

doi:10.1109/eptc.2008.4763536

2008 10th Electronics Packaging Technology Conference 2008

DOI: 10.1109/eptc.2008.4763536

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Reliability of Various Types of Wafer Level Package (WLP) for Mobile Application

Gi-Jo Jung¹,

Yun-Mook Park²,

Insoo Kang³

et al.

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Reliability of fine pitch wafer level packages

Yang

Xiao

et al. 2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Wafer level packaging (WLP) is regarded as one of the most potential single chip packages for its compatibility with wafer fabrication process. As the pitch size of the package becomes lower, the reliability of fme pitch WLP devices is greatly challenged. Finer pitch may result in weaker solder joints, which leads to reliability problems such as fatigue failure, creep deformation and so on. Much work has been done to investigate the reliability of wafer level package above 500 f!m pitch under different conditions such as temperature cycling, thermal shock and drop test, etc. Nevertheless, there are few reports about the reliability of WLP with pitch size less than 500 f!m. In this study, WLP with a size of 5x5 mm 2 and a pitch of 400 f!m were fabricated. Each chip has 144 lead-free SAC105 solder balls in an array of 12x12. The chips are retlowed on Nil Au pads on boards. The chips were experienced a set of reliability tests including temperature cycling, thermal shock and drop test according to JEDEC standards. Furthermore, failure analysis is carried out to study the failure mechanism. Failures are found mostly inside of the solder ball after TC and TS tests, while the drop tests cause more damage to the solder-board and solder-chip interface.

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Reliability of fine pitch wafer level packages

Yang

Xiao

et al. 2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

View full text Add to dashboard Cite

show abstract

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Reliability of Various Types of Wafer Level Package (WLP) for Mobile Application

Cited by 1 publication

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Reliability of fine pitch wafer level packages

Reliability of fine pitch wafer level packages

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