Reliability of SnPb and Pb-free flip–chips under different test conditions

Spraul, M.; Nüchter, W.; Moller, A. B.; Wunderle, Bernhard; Michel, B.

doi:10.1016/j.microrel.2006.09.026

Cited by 18 publications

(6 citation statements)

References 10 publications

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“…13, where solder joints of different packages and solder materials are subjected to different loading cycles. It is clearly seen, that higher temperature delta and longer dwell time decrease reliability (Spraul et al 2007). Such acceleration relations can be modelled within the already mentioned solder reliability approaches based, on e.g.…”

Section: Accelerated and Combined Testingmentioning

confidence: 92%

Lifetime modelling for microsystems integration: from nano to systems

Wunderle

Michel

2009

Microsyst Technol

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Due to the rapid development of IC technology the traditional packaging concepts are making a transition into more complex system integration techniques in order to enable the constantly increasing demand for more functionality, performance, miniaturisation and lower cost. These new packaging concepts (as e.g. system in package, 3D integration, MEMS-devices) will have to combine smaller structures and layers made of new materials with even higher reliability. As these structures will more and more display nano-features, a coupled experimental and simulative approach has to account for this development to assure design for reliability in the future. A necessary ''nano-reliability'' approach as a scientific discipline has to encompass research on the properties and failure behaviour of materials and material interfaces under explicit consideration of their micro-and nano-structure and the effects hereby induced. It uses micro-and nano-analytical methods in simulation and experiment to consistently describe failure mechanisms over these length scales for more accurate and physically motivated lifetime prediction models. This paper deals with the thermo-mechanical reliability of microelectronic components and systems and methods to analyse and predict it. Various methods are presented to enable lifetime prediction on system, component and material level, the latter promoting the field of nano-reliability for future packaging challenges in advanced electronics system integration.

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Section: Accelerated and Combined Testingmentioning

confidence: 92%

Lifetime modelling for microsystems integration: from nano to systems

Wunderle

Michel

2009

Microsyst Technol

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“…(Wunderle et al 2004b)] one averages over the region where damage occurs, avoid singularities and numerical effects at interfaces [see, e.g. (Syed 2001;Spraul et al 2007)]. In the case of a solder ball the failure definition is a through crack, therefore one averages over the whole diameter of the ball.…”

Section: A: Lifetime Model For Soldersmentioning

confidence: 99%

Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

et al. 2009

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In this paper we examine the thermo-mechanical reliability of polymer-encapsulated chip-on-board (COB) assemblies for power applications by simulation and experiment. Thereby the focus is set on the low cycle fatigue failure behaviour of the die-attach material under thermal cycling conditions. As die-attach material different solder materials and Ag-filled thermal adhesives have been used. The encapsulation was performed with a soft silicone-based and hard silica-reinforced epoxy-based material, respectively. An other process variable takes into account die-tilt. The study was carried out as a feasibility analysis in the course of a COB technology development. To this end lifetime models have been employed to correlate crack growth in the, i.e. attach to a computational accumulative failure criterion which allows to consistently describe ad predict quantitatively the lifetime of the assemblies. Thereby a considerable influence of the encapsulation was found. In particular it could be shown that a hard encapsulation largely increases reliability for solder die-attach

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“…One approach is developed by conducting a displacement-controlled isothermal mechanical fatigue test using bulk solder material [16]- [19] and microjoint specimen [20]. The other one is developed by combining actual test data and the FE simulation results [21]- [23]. Lee et al [24] divided fatigue models into five categories, namely, 1) stress-based model, 2) plastic strain-based model, 3) creep strain-based model, 4) energy-based model, and 5) damage accumulated-based model.…”

Section: Introductionmentioning

confidence: 99%

Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling

Pang

2013

IEEE Trans. Device Mater. Relib.

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In this paper, thermal cycling tests and finiteelement analysis (FEA) for a plastic ball grid array package with Sn-3.8Ag-0.7Cu lead-free solder joints have been performed. The solder joint fatigue lives were predicted and compared by using different 2-D and 3-D FEA models. The effects of solder constitutive models and fatigue life models on solder fatigue life prediction have been investigated. In order to obtain fatigue parameters, new averaging volumes were proposed for the solder fatigue life prediction. Different reference temperatures were simulated to investigate its effect on the solder fatigue life prediction. The effect of intermetallic compound thickness on solder joint fatigue life prediction was also investigated. Index Terms-Fatigue reliability, finite-element (FE) modeling, lead-free solder, life prediction, thermal cycling (TC).

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Reliability of SnPb and Pb-free flip–chips under different test conditions

Cited by 18 publications

References 10 publications

Lifetime modelling for microsystems integration: from nano to systems

Lifetime modelling for microsystems integration: from nano to systems

Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling

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