Reliability of plastic-encapsulated electronic components in supersaturated steam environments

George, Jinto; Compagno, Tony; Rodgers, Ken; Waldron, Finbarr; Barrett, J.

doi:10.1109/tcpmt.2015.2470596

Cited by 5 publications

(3 citation statements)

References 12 publications

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“…Although fractures, encapsulant delamination and electrical failure were some of the stress factors observed on the WSM after 100 cycles, the application has promising attributes. The study in [ 40 ] also shows that good reliability can be achieved at 3 mm on HTFR4 Epoxy-glass PCB and FP4460 Epoxy encapsulant. Furthermore, the failure due to temperature cycling is disproportional, and larger components are more exposed to the thermomechanical stress.…”

Section: Macro Purview Of Cots-enabled Iwmdsmentioning

confidence: 99%

“…Medical steam sterilizers (MSSs) utilize extremely fast cycles of temperature, humidity and pressure to sterilize medical instruments, which represents an exceptionally harsh environment for electronics components [ 40 ]. Therefore, it is necessary to study the failure mechanisms of plastic-encapsulated modules such as IWMDs and determine the level of deterioration of encapsulant adhesion over multiple sterilization cycles.…”

Section: Macro Purview Of Cots-enabled Iwmdsmentioning

confidence: 99%

See 1 more Smart Citation

Commercial Off-the-Shelf Components (COTS) in Realizing Miniature Implantable Wireless Medical Devices: A Review

Khan

Mugisha

Tsiamis

et al. 2022

Sensors

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Over the past decade, there has been exponential growth in the per capita rate of medical patients around the world, and this is significantly straining the resources of healthcare institutes. Therefore, the reliance on smart commercial off-the-shelf (COTS) implantable wireless medical devices (IWMDs) is increasing among healthcare institutions to provide routine medical services, such as monitoring patients’ physiological signals and the remote delivery of therapeutic drugs. These smart COTS IWMDs reduce the necessity of recurring visits of patients to healthcare institutions and also mitigate physical contact, which can minimize the possibility of any potential spread of contagious diseases. Furthermore, the devices provide patients with the benefit of recuperating in familiar surroundings. As such, low-cost, ubiquitous COTS IWMDs have engendered the proliferation of telemedicine in healthcare to provide routine medical services. In this paper, a review work on COTS IWMDs is presented at a macro level to discuss the history of IWMDs, different networked COTS IWMDs, health and safety regulations of COTS IWMDs and the importance of organized procurement. Furthermore, we discuss the basic building blocks of IWMDs and how COTS components can contribute to build these blocks over widely researched custom-built application-specific integrated circuits.

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Section: Macro Purview Of Cots-enabled Iwmdsmentioning

confidence: 99%

Section: Macro Purview Of Cots-enabled Iwmdsmentioning

confidence: 99%

Commercial Off-the-Shelf Components (COTS) in Realizing Miniature Implantable Wireless Medical Devices: A Review

Khan

Mugisha

Tsiamis

et al. 2022

Sensors

View full text Add to dashboard Cite

show abstract

“…These properties differ among them because of the different formulations made to improve specific properties that enhance individual performances. These are related to thermal resis-tance, electric insulation, reliability in moisture, reliability temperature, and pressure [132]. Incorporating fillers such as alumina, boron nitride, alumina nitride, or other ceramic powder increases the thermal conductivity of the encapsulation's electrical insulation [129].…”

Section: Electrical Encapsulation Materialsmentioning

confidence: 99%

Application and Suitability of Polymeric Materials as Insulators in Electrical Equipment

et al. 2021

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In this paper, the applications of thermoplastic, thermoset polymers, and a brief description of the functions of each subsystem are reviewed. The synthetic route and characteristics of polymeric materials are presented. The mechanical properties of polymers such as impact behavior, tensile test, bending test, and thermal properties like mold stress-relief distortion, generic thermal indices, relative thermal capability, and relative thermal index are mentioned. Furthermore, this paper covers the electrical behavior of polymers, mainly their dielectric strength. Different techniques for evaluating polymers’ suitability applied for electrical insulation are covered, such as partial discharge and high current arc resistance to ignition. The polymeric materials and processes used for manufacturing cables at different voltage ranges are described, and their applications to high voltage DC systems (HVDC) are discussed. The evolution and limitations of polymeric materials for electrical application and their advantages and future trends are mentioned. However, to reduce the high cost of filler networks and improve their technical properties, new techniques need to be developed. To overcome limitations associated with the accuracy of the techniques used for quantifying residual stresses in polymers, new techniques such as indentation are used with higher force at the stressed location.

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Failure analysis of plastic encapsulated circuits after autoclaving

Pei

Wan

et al. 2016

Engineering Failure Analysis

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Reliability of plastic-encapsulated electronic components in supersaturated steam environments

Cited by 5 publications

References 12 publications

Commercial Off-the-Shelf Components (COTS) in Realizing Miniature Implantable Wireless Medical Devices: A Review

Commercial Off-the-Shelf Components (COTS) in Realizing Miniature Implantable Wireless Medical Devices: A Review

Application and Suitability of Polymeric Materials as Insulators in Electrical Equipment

Failure analysis of plastic encapsulated circuits after autoclaving

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