2019
DOI: 10.1109/ted.2019.2917785
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Reliability of NAND Flash Arrays: A Review of What the 2-D–to–3-D Transition Meant

Abstract: This paper reviews what changed in the reliability of NAND Flash memory arrays after the paradigm shift in technology evolution determined by the transition from 2-D to 3-D integration schemes. Starting from a quick glance at the fundamentals of raw array reliability, the reasons for its worsening with the evolution of 2-D technologies will be discussed, focusing on the physical phenomena which contributed more to that outcome. By exploring the dependence of the magnitude of these phenomena on cell and array p… Show more

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Cited by 61 publications
(27 citation statements)
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“…For advanced DRAM processes where the SN capacitance has shrunk below 10 fF [24], this would require less than 5000 electrons. In the latter case, each electron would result in an SN potential shift of about 20 μV making it one of the most sensitive electrometers in existence except for the case of a NAND Flash cell transistor [57]. Second, the retrograde p-well presents a reflecting electric field to any stray electrons within the p-well.…”
Section: Dram Array Structurementioning
confidence: 99%
“…For advanced DRAM processes where the SN capacitance has shrunk below 10 fF [24], this would require less than 5000 electrons. In the latter case, each electron would result in an SN potential shift of about 20 μV making it one of the most sensitive electrometers in existence except for the case of a NAND Flash cell transistor [57]. Second, the retrograde p-well presents a reflecting electric field to any stray electrons within the p-well.…”
Section: Dram Array Structurementioning
confidence: 99%
“…Therefore, it is more serious problem that not VTH-up error by capacitive coupling but VTHdown error by lateral charge migration as data-retentions time increases. The impact of capacitive coupling is smaller than that of lateral charge migration because this paper researches 3D charge-trap NAND flash memory [12][13]. Fig.…”
Section: Measurement Resultsmentioning
confidence: 98%
“…The rest of the cells are contacted by planar wordlines that span over an entire block of the array. One of the advantages of this structure is that the large increase in density allowed by the exploitation of the third dimension makes it possible to relieve some of the pressure on channel length scaling and its many drawbacks from the viewpoint of process complexity and reliability, well known in planar devices [ 52 , 53 ]: cell length in 3D NAND is around 25–30 nm [ 54 ], with the additional advantage of becoming less dependent on the availability of advanced lithography tools. A second advantage of this solution lies in its manufacturing process: memory cells are not patterned individually, but they are formed all at once as cylindrical holes are cut through the stacked wordlines, creating the strings.…”
Section: Array and Cell Structurementioning
confidence: 99%