Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications

Su, Sinan; Akkara, Francy John; Raj, Anto; Zhao, Cong; Gordon, Seth; Sridhar, Seetharaman; Thirugnanasambandam, S.; Hamasha, Sa’d; Suhling, Jeff; Evans, John L.

doi:10.1109/ectc.2019.00318

Cited by 8 publications

(1 citation statement)

References 13 publications

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“…Most of these microstructures are fabricated using standard or UV versions of LIGA (lithographie, galvanoformung, abformung) techniques. From the perspective of advanced industrial applications, alloys are expected to play a major role in complex 3D microstructures such as photonic crystals [6,7], interconnects [8,9], and biosensors [10,11]. However, common techniques such as LIGA or UV-LIGA are not always well suited for preparing such complex 3D designs.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical 3D printing of Ni–Mn and Ni–Co alloy with FluidFM

Shen¹,

Zhu²,

Zhu³

et al. 2022

Nanotechnology

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Additive manufacturing can realize almost any designed geometry, enabling the fabrication of innovative products for advanced applications. Local electrochemical plating is a powerful approach for additive manufacturing of metal microstructures; however, previously reported data have been mostly obtained with copper, and only a few cases have been reported with other elements. In this study, we assessed the ability of fluidic force microscopy (FluidFM) to produce Ni-Mn and Ni-Co alloy structures. Once the optimal deposition potential window was determined, pillars with relatively smooth surfaces were obtained. The printing process was characterized by printing rates in the range of 50-60 nm/s. Cross-sections exposed by focused ion beam showed highly dense microstructures, while the corresponding face scan with energy-dispersive X-ray spectroscopy (EDX) spectra revealed a uniform distribution of alloy components.

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