Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

Xia, Yanghua; Xie, Xiaoming

doi:10.1016/j.jallcom.2006.12.098

Cited by 41 publications

(17 citation statements)

References 17 publications

(25 reference statements)

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“…Meanwhile, the pull strength of solder joints with OSP and ENIG finishes on PCB were compared and found that the OSP joints had higher strength [39]. It is believed that the Cu 6 Sn 5 precipitates inside the bulk solder promote the reliability performance of the OSP solder [40] since the precipitates deviates the crack from the shortest distance through the joint, and slows down the propagation [41,42]. The phenomenon was shown in Figure 7.…”

Section: Mechanical Testingmentioning

confidence: 99%

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A review on the effect of surface finish and cooling rate on solder joint reliability

Kahar¹,

Akhtar²,

Idris³

et al. 2016

WIT Transactions on the Built Environment

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With increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders provides an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for the evaluation of the solder joint reliability with respect to solder alloys and surface finishes. However, as the demand of electronic devices is increasing, there is a need to improve the mechanical properties of the solder joint in order to keep up with the current evolution of electronic devices' technology. In this study, the effect of surface finish and cooling rate on solder joint reliability using nickel-based surface finish was summarized. The study focused on nickel based surface finish (ENIG and ENEPIG) with different cooling media, slow (furnace), medium (air) and fast (water). It was found that the type of surface finish and the cooling rate can change the morphology of the solder intermetallic compound (IMC) and directly changes the solder joint mechanical properties. A faster cooling rate was reported to provide finer IMC grains which might be translated into better solder joint strength. The findings presented here may provide a better understanding for further study and facilitate improvements in terms of solder joint reliability.

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Section: Mechanical Testingmentioning

confidence: 99%

“…In terms of thermal cycle, Xia and Xie [41] in their study of the reliability of lead-free electronic assemblies under thermal cycling with OSP and ENIG surface finish found that OSP finish gave better performance than its ENIG counterparts. It was reported that for both cases, the crack originates at the fringe of heel fillet.…”

Section: Thermal Analysismentioning

confidence: 99%

A review on the effect of surface finish and cooling rate on solder joint reliability

Kahar¹,

Akhtar²,

Idris³

et al. 2016

WIT Transactions on the Built Environment

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show abstract

“…After July 1, 2006, the RoHS is taking effect and electronics products sold to Europe must not contain lead [1]. Thus, the Sn-Ag-Cu solder is one of the choices that can replace the leaded solder and commonly used in surface mount technology (SMT) assembly for microelectronics into industrial production [2].…”

Section: Introductionmentioning

confidence: 99%

Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes

Azlina

Ourdjini

Ibrahim

2015

AMM

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Abstract. In electronics industries, most of them had to shifted their solder materials from leaded solders into lead-free solders due to the environmental concerns and follow the legislation of Restriction of use Hazardous Substances (RoHS). Thus, Sn-Ag-Cu solder is one of the choices that can replace the leaded solder and also offer better properties. This study investigates the comparison between Sn-4.0Ag-0.5Cu (SAC405) and EN(P)EPIG and EN(B)EPIG surface finishes. Reliability of solder joint has been assessed by performing solid state isothermal aging at 150ºC for 250 up to 2000 hours. After reflow soldering process, (Cu,Ni) 6 Sn 5 intermetallic compound (IMC) is dominated at near centre of solder meanwhile (Ni,Cu) 3 Sn 4 IMC is dominated at near outside of solder ball . Moreover, aging time resulted in an increase in thickness and changed the morphology into more spherical, dense and large grain size. Analysis by optical microscope revealed that the IMC thickness of EN(B)EPIG produced thicker IMC compared to EN(P)EPIG surface finish during reflow as well as isothermal aging.

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“…However, the inherent environmental and health toxicity concerns they pose, in addition to government regulations and legislation, have contributed to the elimination of the conventional Sn-Pb solders from microelectronic devices [2][3][4]. Therefore, to replace lead-containing solder alloys in the packaging systems of electronic devices and components, several research groups have focused on developing new lead-free solders.…”

Section: Introductionmentioning

confidence: 99%

“…Its aims were: (1) to determine the interfacial IMCs that appeared between plain Sn-Ag-Cu and Sn-Ag-Cu-0.5Ni composite solders on plain Cu and immersion Ag plated Cu substrates, (2) to evaluate the relationships between the growth rate, temperature and time involved in the formation of IMCs,-and (3) measure their hardness depending on the number of reflow cycles.…”

Section: Introductionmentioning

confidence: 99%

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

Fouzder

Chan

et al. 2014

J Mater Sci: Mater Electron

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Sn-Ag-Cu composite solder has been prepared by adding Ni nanoparticles. Interfacial reactions, the morphology of the intermetallic compounds (IMC) that were formed, the hardness between the solder joints and the plain Cu/immersion Ag-plated Cu pads depending on the number of the reflow cycles and the aging time have all been investigated. A scallop-shaped Cu 6 Sn 5 IMC layer that adhered to the substrate surface was formed at the interfaces of the plain Sn-Ag-Cu solder joints during the early reflow cycles. A very thin Cu 3 Sn IMC layer was found between the Cu 6 Sn 5 IMC layer and the substrates after a lengthy reflow cycle and solid-state aging process. However, after adding Ni nanoparticles, a scallop-shaped (Cu, Ni)-Sn IMC layer was clearly observed at both of the substrate surfaces, without any Cu 3 Sn IMC layer formation. Needle-shaped Ag 3 Sn and sphere-shaped Cu 6 Sn 5 IMC particles were clearly observed in the b-Sn matrix in the solder-ball region of the plain Sn-Ag-Cu solder joints. Additional fine (Cu, Ni)-Sn IMC particles were found to be homogeneously distributed in the b-Sn matrix of the solder joints containing the Ni nanoparticles. The Sn-Ag-Cu-0.5Ni composite solder joints consistently displayed higher hardness values than the plain Sn-Ag-Cu solder joints for any specific number of reflow cycles-on both substratesdue to their well-controlled, fine network-type microstructures and the homogeneous distribution of fine (Cu, Ni)-Sn IMC particles, which acted as second-phase strengthening mechanisms. The hardness values of Sn-AgCu and Sn-Ag-Cu-0.5Ni on the Cu substrates after one reflow cycle were about 15.1 and 16.6 Hv, respectivelyand about 12.2 and 14.4 Hv after sixteen reflow cycles, respectively. However, the hardness values of the plain SnAg-Cu solder joint and solder joint containing 0.5 wt% Ni nanoparticles after one reflow cycle on the immersion Ag plated Cu substrates were about 17.7 and 18.7 Hv, respectively, and about 13.2 and 15.3 Hv after sixteen reflow cycles, respectively.

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Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

Cited by 41 publications

References 17 publications

A review on the effect of surface finish and cooling rate on solder joint reliability

A review on the effect of surface finish and cooling rate on solder joint reliability

Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

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